FIT deploys three key industries and three core technologies, of which the three key industries are EV Mobility, 5G AIOT, and Audio. The innovative technologies, products and services of these three key industries; will bring a remarkable and satisfying user experience. The three core technologies are Copper to Optics, Wire to Wireless, and Component to Module. These three key technology areas can provide services for various world-class brands and private label products across B2C and B2B; we are the world's leading technology and pioneers of technology trends.
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EV Mobility
EV mobility will be the major catalyst as growing EV models are launched in the upcoming 2 to 3 years by legacy ICE auto manufacturers and EV start-ups. Leveraging our core technologies and vertical integration in interconnectivity solutions, FIT will target the triangular sweet spots for EV connectivity, with solutions for power connection, data & command connection, as well as human-to-machine connectivity. In 2021, we laid the foundation by pooling resources within the MIH alliance to accelerate our transition to capture the rapidly expanding EV market.
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5G AIoT
We have acquired a leading position in the IaaS industry and developed core technologies over the years. Capitalizing on these advantages, we shall build market leadership in high-speed interconnectivity solutions for IoT and the 5G/6G infrastructure, which supports higher cloud transmission performance and line extension for audio.
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Audio
We are developing high-quality acoustic modules and establishing our presence for the audio supply chain. Leveraging our R&D and vertically integrated manufacturing capability, FIT can provide a full spectrum of partnering solutions – from ODM, OEM to OBM manufacturing for our brand customers.
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3 key industries
Combining FIT‘s rich industrial experience and supply chain advantages, we will continue to improve the development of new products in the 3 key industries and drive profit growth in the future.
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Copper to Optics
The upgrading of data communication technology has spawned a variety of new business application requirements, resulting in an explosive increase in traffic demand. The widespread adoption of fiber optic connectors in the communication infrastructure end market is due to its advantages of low signal attenuation, high speed and noise immunity. Compared to copper connectors, fiber optic connectors can provide more bandwidth and better signal over longer distances as well as reliable data with less interference.
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Wire to Wireless
FIT has been working in the field of networking for over two decades, we keep up with the industry trend of wireless applications. FIT focus on developing technologies of power (wireless charging products) and signal (millimeter wave applications) related application which takes into account both safety and convenience.
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Component to Module
As a leading manufacturer of components, with a certain level of assembly technology, FIT provides services for various world-class brands and private label products across B2C and B2B; we are the world's leading technology and pioneers of technology trends.
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3 key technology areas
In addition to leveraging our own R&D capabilities to deploy the three major technologies, FIT has continuously improved its technological content through alliances, joint ventures and acquisitions, while expanding its technology application fields.
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Manufacturing of high precision components
The manufacturing of connector is characterized by a high degree of precision, and the trend of miniaturization of electronic equipment has increased the demand for professional design of micro connectors, which making FIT's leading position in the ICT industry.
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Connectivity Solutions
Connector products play key role in the performance of electronic products, and are required to have high quality of transmission capabilities involving telecommunications, data, power, and acoustics.
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Rapid Ramp-up Large scale of Manufacturing
In the past, by optimizing resource allocation, FIT was able to rapidly ramp up Large scale in a short period of time, and be able to produce technically complex products on a large scale. Therefore, FIT has accumulated quite a complete experience, and has passed the customer's strict selection of suppliers' audit procedures, making us the favorite of many well-known customers. Key suppliers and strategic relationships with us all demonstrate our strong production capacity and quality.
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Three core technologies
With the core competencies of design and precise manufacturing, quick-to-ramp, high-volume and flexible production capabilities, collaborative relationships with industry-leading customers that integrate our solutions into their design, development and production processes, hon hai group ecosystem provides a unique competitive advantage, experienced and committed management team.
FIT INTRODUCES QSFP-DD800 CONNECTOR / DAC SOLUTIONS AT OFC 2022
Teaming up with Broadcom / MultiLane to show 800G Interconnection solution.
2022-03-04
San Diego – 2022/03/08 – Foxconn Interconnect Technology (6088.HK) (“FIT”), a leading connective solution provider creating powerful connections for a better world, will jointly exhibit the QSFP-DD800 interconnection with Broadcom's low power Active Copper Cable (ACC) PHY (BCM87850) and MultiLane’s ML4039EN BERT in the Optical Networking and Communication Conference & Exhibition (“OFC”), which will be held on March 8 to 10, 2022 in San Diego, USA.
The new generation of communication technology (5G/6G) realizes various possibilities of cloud applications, and also brings higher cloud transmission demand. The explosive growth of traffic requires higher bandwidth. 800G is the fastest transmission speed in the market, which allows an upgrade of switch data rate from 12Tbps to 25.6Tbps / 51.2Tbps.
“We are honored to cooperate with Broadcom / MultiLane to show our interconnect solution, and demonstrate its execution of 5GAIoT strategy.” said Mr. Joseph Wang, CTO of FIT Hon Teng. "Last year, we established a few new pillars of corporate priorities, and building the future of 5GAIoT is one of them".
MultiLane is leading the development of test solutions for 800G passive and active copper cables, as well as their enabling active silicon. Their portfolio of BERT, DSO and TDR products and solutions offers unique capabilities that are crucial for the development of the 800G ecosystem.
“Our goal is to always be early to build innovative products and solutions in close collaboration with our partners, like Broadcom and FIT, that enable our customers to keep up with the bandwidth and performance requirements of today’s technological breakthroughs.” said Elias Khoury, Product Line Manager at MultiLane.
At OFC, the world's largest optical networking and communications exhibition, FIT demonstrates its QSFP-DD800 solution. The solution not only supports the data center companies, telecom operators, switch makers, server makers and test equipment operators to complete the innovation design, but also helps our partners to approach carbon neutrality. With the technology of optimization and immersion cooling application in the 800G interconnect products, FIT provides relevant solutions that support lower energy and carbon consumption.
Please check out the 800G demo at the Broadcom Booth# 5801 / MultiLane Booth# 3915.
About Foxconn Interconnect Technology (”FIT“):
FIT Hon Teng Limited (6088.HK), is a market leader of interconnect solutions for mobile devices, digital computer and consumer electronics, communication infrastructure, automotive, industry and medical applications and connected smart devices. For more information about FIT, please see: www.fit-foxconn.com .
About MultiLane:
MultiLane Inc. is a leading provider of High-Speed IO and Data Center Interconnect test solutions from 10G to 800G. Products include BERTs, TDR, optical and electrical oscilloscopes, optical switch boxes, and a host of MSA-compliant development tools for QSFP28, QSFP-DD, OSFP, and other standards. MultiLane’s products are used to test semiconductors, DACs, AOCs, active cables, optical transceivers, and system switch cards. MultiLane also offers compliance test services, signal integrity design services, and fully automated, turn-key test solutions. In addition, MultiLane develops high speed ATE modules that fit in wafer-scale automated test systems such as Advantest’s V93K platform. For more information, please visit www.multilaneinc.com and follow us on LinkedIn, Twitter and Facebook.
News Contact: EMAIL: fit-ir@fit-foxconn.com Product Service Contact:
FIT Hon Teng Showcases AI Data Center Connectivity Solutions at OCP Global Summit
Hong Kong – October 17, 2024 – FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), is proud to present their AI rack connectivity solutions at the Open Compute Project (OCP) Global Summit. OCP is a global initiative focused on redesigning hardware to accommodate the increasing demands of computing infrastructure. It fosters collaboration across the tech industry, promoting open standards that improve efficiency and reduce data center costs. Through close cooperation with upstream vendors, OCP’s solutions tackle critical challenges such as signal degradation, heat dissipation, and scalability for large-scale manufacturing, which are critical needs for today’s AI-driven data centers.
2024-10-16
Hong Kong – October 16, 2024 – FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), is proud to present their AI rack connectivity solutions at the Open Compute Project (OCP) Global Summit. OCP is a global initiative focused on redesigning hardware to accommodate the increasing demands of computing infrastructure. It fosters collaboration across the tech industry, promoting open standards that improve efficiency and reduce data center costs. Through close cooperation with upstream vendors, OCP’s solutions tackle critical challenges such as signal degradation, heat dissipation, and scalability for large-scale manufacturing, which are critical needs for today’s AI-driven data centers. Recently, FIT presented key AI data center connector products at Hon Hai Technology Day 2024, including high-current connectors and cables designed to improve power transmission and cooling efficiency and liquid cooling quick connectors tailored for next-generation AI racks. At this year’s OCP Global Summit, FIT will introduce AI rack connectivity solutions to improve signal integrity, ensuring smooth data transmission between systems. The solutions also incorporate advanced heat dissipation technologies, providing stability for high-density AI workloads while being scalable for mass production and large-scale AI deployments. FIT’s technical expertise in high-performance data center solutions complements Foxconn group’s strengths in industrial internet solutions, creating a dynamic partnership to deliver innovative AI connectivity solutions. By showcasing a full-rack architecture featuring high-speed and high-power connectors and cables, FIT is exhibiting its growing portfolio of off-the-shelf and custom connectivity options for its data center customers. Key products on display: ‧ Custom 224G+ sockets for XPU/GPU 224G+ connectivity ‧ Co-packaged copper and optics architectures ‧ Power cables for ORV3 ‧ Active Optical Cables ‧ OSFP1600 and QSFP-DD port configurations By focusing on performance, efficiency, and scalability, FIT aims to support the growing needs of AI infrastructure across industries.
Foxconn Interconnect Technology (FIT) to Present Optimizing Signal Integrity Solutions in Immersion-Cooled IT Platforms at OCP Global Summit 2024
San Jose, California – October 15, 2024 – Foxconn Interconnect Technology (FIT) is excited to present at the upcoming OCP Global Summit, focusing on the impact of immersion cooling on signal integrity in IT platforms. The Open Compute Project (OCP) is a global initiative that seeks to redesign hardware infrastructure to meet the growing demands of modern data centers. FIT’s session, led by Terry Little, Development Engineering Manager, will tackle a critical issue faced by the industry: maintaining high-speed signal integrity in immersion-cooled environments.
2024-10-15
San Jose, California – October 15, 2024 – Foxconn Interconnect Technology (FIT) is excited to present at the upcoming OCP Global Summit, focusing on the impact of immersion cooling on signal integrity in IT platforms. The Open Compute Project (OCP) is a global initiative that seeks to redesign hardware infrastructure to meet the growing demands of modern data centers. FIT’s session, led by Terry Little, Development Engineering Manager, will tackle a critical issue faced by the industry: maintaining high-speed signal integrity in immersion-cooled environments. At this year’s OCP Global Summit, FIT will introduce advanced solutions to optimize signal transmission within immersion-cooled IT platforms. Immersion cooling, where electronic components are submerged in a dielectric fluid, is becoming a key technology for reducing heat and improving efficiency in high-density computing environments. However, it presents unique challenges to signal integrity, particularly for high-speed data transmission lines. The session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms” will highlight the effects of dielectric fluids on high-speed signal testing and propose solutions to enhance testing methods and connector performance. Terry Little will discuss how fixture improvements can further support consistent signal transmission, ensuring reliable performance in AI and data center applications. Key topics covered will include:
‧ The influence of immersion fluids on high-speed signal lines ‧ Challenges faced during high-speed testing in immersion-cooled environments ‧ Innovative connector fixture strategies to improve signal integrity FIT’s ongoing efforts to innovate in AI-driven data center solutions are showcased in their growing portfolio of cutting-edge connectivity products, including high-speed and high-power connectors that maintain performance in harsh environments such as immersion cooling systems.
