Hong Kong – October 16, 2024 – FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), is proud to present their AI rack connectivity solutions at the Open Compute Project (OCP) Global Summit. OCP is a global initiative focused on redesigning hardware to accommodate the increasing demands of computing infrastructure. It fosters collaboration across the tech industry, promoting open standards that improve efficiency and reduce data center costs. Through close cooperation with upstream vendors, OCP’s solutions tackle critical challenges such as signal degradation, heat dissipation, and scalability for large-scale manufacturing, which are critical needs for today’s AI-driven data centers.
Recently, FIT presented key AI data center connector products at Hon Hai Technology Day 2024, including high-current connectors and cables designed to improve power transmission and cooling efficiency and liquid cooling quick connectors tailored for next-generation AI racks.
At this year’s OCP Global Summit, FIT will introduce AI rack connectivity solutions to improve signal integrity, ensuring smooth data transmission between systems. The solutions also incorporate advanced heat dissipation technologies, providing stability for high-density AI workloads while being scalable for mass production and large-scale AI deployments.
FIT’s technical expertise in high-performance data center solutions complements Foxconn group’s strengths in industrial internet solutions, creating a dynamic partnership to deliver innovative AI connectivity solutions. By showcasing a full-rack architecture featuring high-speed and high-power connectors and cables, FIT is exhibiting its growing portfolio of off-the-shelf and custom connectivity options for its data center customers.
Key products on display:
‧ Custom 224G+ sockets for XPU/GPU 224G+ connectivity
‧ Co-packaged copper and optics architectures
‧ Power cables for ORV3
‧ Active Optical Cables
‧ OSFP1600 and QSFP-DD port configurations
By focusing on performance, efficiency, and scalability, FIT aims to support the growing needs of AI infrastructure across industries.

San Jose, California　– October 15, 2024 –　Foxconn Interconnect Technology (FIT) is excited to present at the upcoming OCP Global Summit, focusing on the impact of immersion cooling on signal integrity in IT platforms. The Open Compute Project (OCP) is a global initiative that seeks to redesign hardware infrastructure to meet the growing demands of modern data centers. FIT’s session, led by Terry Little, Development Engineering Manager, will tackle a critical issue faced by the industry: maintaining high-speed signal integrity in immersion-cooled environments.
At this year’s OCP Global Summit, FIT will introduce advanced solutions to optimize signal transmission within immersion-cooled IT platforms. Immersion cooling, where electronic components are submerged in a dielectric fluid, is becoming a key technology for reducing heat and improving efficiency in high-density computing environments. However, it presents unique challenges to signal integrity, particularly for high-speed data transmission lines.
The session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms” will highlight the effects of dielectric fluids on high-speed signal testing and propose solutions to enhance testing methods and connector performance. Terry Little will discuss how fixture improvements can further support consistent signal transmission, ensuring reliable performance in AI and data center applications.
Key topics covered will include:

‧ The influence of immersion fluids on high-speed signal lines
‧ Challenges faced during high-speed testing in immersion-cooled environments
‧ Innovative connector fixture strategies to improve signal integrity
FIT’s ongoing efforts to innovate in AI-driven data center solutions are showcased in their growing portfolio of cutting-edge connectivity products, including high-speed and high-power connectors that maintain performance in harsh environments such as immersion cooling systems.