FIT Advances 102.4T CPO External Laser Platform into Validation - FIT Deepens Its Commitment to AI Optical Interconnect Infrastructure
Taipei, March 2, 2026 — FIT Hon Teng Limited (HKEX: 06088), a subsidiary of Hon Hai Technology Group, today announced that its 102.4T Co-Packaged Optics (CPO) External Laser Solution has completed key development milestones and entered ecosystem validation. FIT will be exhibiting at OFC 2026 (Optical Fiber Communication Conference and Exposition) from March 16–19, underscoring its strategic focus on next-generation AI optical interconnect infrastructure. We look forward to seeing you at the world’s largest international event for optical networking and communications.
2026-03-02
Taipei, March 2, 2026 —
FIT Hon Teng Limited (HKEX: 06088), a subsidiary of Hon Hai Technology Group, today announced that its 102.4T Co-Packaged Optics (CPO) External Laser Solution has completed key development milestones and entered ecosystem validation. FIT will be exhibiting at OFC 2026 (Optical Fiber Communication Conference and Exposition) from March 16–19, underscoring its strategic focus on next-generation AI optical interconnect infrastructure. We look forward to seeing you at the world’s largest international event for optical networking and communications.
As AI training clusters and hyperscale data centers transition toward 102.4T switching platforms, the industry is accelerating adoption of CPO architectures to address power density, signal integrity, and thermal constraints. Leveraging its long-standing expertise in high-speed interconnect and precision opto-mechanical integration, FIT has expanded its capabilities into external laser modules and package-level optical integration, enabling scalable system-level CPO deployments.
FIT’s 102.4T ELSFP (External Laser Small Form-Factor Pluggable) platform delivers a modular, hot-pluggable laser source designed to support serviceability and operational flexibility in CPO-based systems. The solution is compliant with OIF ELSFP 2.0 and CMIS Rev 5.1 specifications and utilizes a 1310 nm CW DFB laser architecture with output power exceeding 20 dBm. Total module power consumption is maintained below 10 W, with up to 20 dB optical link budget, meeting the performance envelope required for next-generation AI switch fabrics.
The platform has been technically validated by NTT Innovative Devices and aligns with the Photonics Electronics Convergence Devices roadmap under the IOWN architecture. Building on its 51.2T development experience, FIT has further enhanced optical coupling accuracy, high-density interconnect reliability, and advanced thermal design to ensure manufacturability, yield stability, and long-term field reliability at the 102.4T node.
The 102.4T ELSFP platform will be showcased at OFC 2026 at FIT’s booth (Booth 1558), featuring detailed module architecture and live performance demonstrations. The solution will also be incorporated into a system-level switching architecture demonstration at the NTT Innovative Devices booth (Booth 629), where FIT is identified as the external laser source provider, reflecting active collaboration within the CPO ecosystem.
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com。
FIT (Foxconn Interconnect Technology) Makes Its Debut at DesignCon 2026: Launching Its 448G CHIPLINK® Solution, Leading a Revolution in AI Data Center Computing Power
[Santa Clara, CA – February 23, 2026] – Foxconn Interconnect Technology (FIT, 6088-HK), a leading provider of connectivity solutions under Hon Hai Technology Group (2317-TW), will showcase its latest innovations at DesignCon 2026 (Booth #719) from February 24–26. Addressing the surging power demands of the AI era, FIT is presenting its vision, "Shaping the Future of Data and Power: From Chips to Grid," featuring comprehensive AI data center solutions including 1.6T interconnects, Next-Gen CHIPLINK® 448G Solutions and next-generation liquid cooling technologies.
2026-02-23
[Santa Clara, CA – February 23, 2026]
Foxconn Interconnect Technology (FIT, 6088-HK), a leading provider of connectivity solutions under Hon Hai Technology Group (2317-TW), will showcase its latest innovations at DesignCon 2026 (Booth #719) from February 24–26. Addressing the surging power demands of the AI era, FIT is presenting its vision, "Shaping the Future of Data and Power: From Chips to Grid," featuring comprehensive AI data center solutions including 1.6T interconnects, Next-Gen CHIPLINK® 448G Solutions and next-generation liquid cooling technologies.
Where Tech Aesthetics Meet Performance: Comprehensive Adaptability
FIT’s booth features a refreshed corporate identity, highlighted by a futuristic geometric angled archway that serves as a bridge between visitors and the technology on display. The design uses layered lines to symbolize the convergence of signals, energy, and information. The layout guides visitors through a narrative journey, showcasing FIT’s ability to integrate connectivity across the entire spectrum — from the power grid down to the silicon chip.
Five Core Highlights: Defining Next-Gen High-Speed Transmission
At this exhibition, FIT is fully promoting its critical technologies specifically designed for AI and High-Performance Computing (HPC) architectures:
1.6T High-Speed Interconnects: Engineered for next-generation AI architectures, providing ultra-high-density bandwidth to satisfy extreme instantaneous data transfer requirements.
Next-Gen CHIPLINK® 448G Solutions: Specifically designed to address the escalating signal integrity, high density, and mechanical integration challenges of 224G and 448G AI/HPC systems. The CHIPLINK® CPC (Cabled Protein Card) architecture utilizes a socketed modular wafer design supporting 30–34 AWG cabling, offering flexible scaling for CPC-to-I/O, CPC-to-CPC, and CPC-to-Backplane topologies. This solution optimizes high-density differential pair routing while significantly improving insertion loss (IL) and crosstalk performance.
Advanced Liquid Cooling: Superior thermal management performance tailored for hyperscale data centers and AI clusters to combat the heat challenges of rising compute density.
PCIe® 6.0 / 7.0 Cabling Solutions: High-performance, low-latency expansion options that optimize connectivity efficiency for AI computing resources.
RF Waveguide Interconnects: Developed in collaboration with Point2 Technology, these cutting-edge high-frequency solutions offer an alternative to traditional copper and fiber, effectively addressing power consumption, reach, and integration hurdles at extreme data rates.
Breaking Physical Barriers: Power Management as the Key to HPC
"The challenge today is no longer just about raw speed; power management is the core priority," said Joseph Wang, CTO of FIT, regarding the structural challenges of AI computing. "Through advanced connectivity, we are committed to helping customers seamlessly integrate high-power components into key AI rack locations without overhauling existing architectures. This ensures data transmission at ultra-low latency while overcoming the physical limits of signal loss."
A Milestone in Transformation: From Components to High-End AI Solutions
FIT’s presence at DesignCon 2026 marks a significant milestone in its evolution from a traditional component manufacturer to a provider of high-end AI computing solutions. Visit us at DesignCon, booth No. 719, where our professional team will present a full range of high-speed data and power transmission solutions.
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at https://www.fit-foxconn.com/.
FIT Announces Groundbreaking of Saudi Joint Venture Smart Mobility at King Salman Energy ParkCEO Prince Fahad N. Al Saud: EV Charging Is Core Energy Infrastructure in the AI Era
FIT Hon Teng (6088.HK), a subsidiary of Hon Hai Technology Group (Foxconn) (TWSE:2317), today announced that Smart Mobility — its joint venture with Saudi-based Saleh Suleiman Alrajhi & Sons — has officially broken ground on a new manufacturing facility at King Salman Energy Park (SPARK) in Dammam. The ceremony marks a new chapter in Saudi Arabia’s journey toward localized production of EV charging infrastructure.
2025-12-08
FIT Hon Teng (6088.HK), a subsidiary of Hon Hai Technology Group (Foxconn) (TWSE:2317), today announced that Smart Mobility — its joint venture with Saudi-based Saleh Suleiman Alrajhi & Sons — has officially broken ground on a new manufacturing facility at King Salman Energy Park (SPARK) in Dammam. The ceremony marks a new chapter in Saudi Arabia’s journey toward localized production of EV charging infrastructure. The ceremony opened with remarks by Mishal I. Al-Zughaibi, President and CEO of SPARK. He noted that SPARK is steadily developing into a leading hub for advanced energy and industrial technologies in the Middle East. Located close to Saudi Arabia’s core energy infrastructure, SPARK offers a mature logistics ecosystem and proximity to Arabian Gulf ports. In the future, it will also connect to the GCC railway network, positioning it as a strategically important base for regional manufacturing, exports, and energy technology innovation Smart Mobility has also installed its high-quality chargers serving as the park’s first EV charging station. This not only demonstrates its technological capabilities, but also underscores Smart Mobility’s role as a key enabler in the transformation of the energy park. In his remarks, Smart Mobility CEO Prince Fahad N. Al Saud noted that while low fuel prices are often cited as a challenge to EV adoption in Saudi Arabia, the Kingdom’s ambition to become the future energy hub for AI is a clear national vision. Globally, the automotive sector is rapidly transitioning toward AI-driven smart mobility. Whether in Level 4 autonomous driving, vehicle connectivity, or AI-based predictive systems, these capabilities all rely fundamentally on electrification. Prince Fahad emphasized that EVs are not merely a for traditional fuel cars, but the essential computing platform for automotive advancement in the AI era. If Saudi Arabia aims to lead in AI, smart cities, and automation, EV charging networks must be regarded as part of the national energy infrastructure. SPARK, rooted in the energy sector, is the ideal base to support this transition. SPARK is wholly owned by Saudi Aramco, one of the world’s top-ten companies by market capitalization and recognized for its rigorous governance, transparency, and engineering excellence. SPARK’s governance standards, engineering protocols, and compliance frameworks are highly aligned with FIT’s global manufacturing systems, providing a solid foundation for precision manufacturing and future capacity expansion. In addition, SPARK’s geographic advantages enhance the competitiveness of Saudi-made products across the region, enabling EV charging equipment manufactured in the Kingdom to access GCC markets more efficiently through the GCC customs union, cross-border logistics, and the future GCC railway network. FIT Chairman Sidney Lu stated in his remarks that the establishment of the Saudi factory represents not just a manufacturing site for FIT, but a long-term commitment to the Kingdom’s industrial development. The creation of Smart Mobility and today’s groundbreaking ceremony are built on mutual trust and collaboration with joint-venture partner Saleh Suleiman Alrajhi & Sons. They also reflect CEO Prince Fahad’s clear strategic vision and steadfast leadership, which have been crucial in bringing the project to fruition. He added that support from the Ministry of Energy and other relevant authorities throughout the SPARK site-selection process significantly was significantly helpful to the project.. Chairman Lu highlighted that FIT operates factories and R&D centers across Asia, Europe, and the Americas, and also automotive production lines in Africa serving European markets — experience that equips the company to build highly reliable, cross-regional manufacturing networks. For the new Saudi facility, it represents FIT establishing an important footprint in EMEA: Saudi Arabia is not merely seeking overseas manufacturing capacity, but is inviting global technology partners to help shape the next chapter of its energy and industrial future. For FIT, this factory represents not only an asset but a commitment — a long-term partnership, shared vision, and mutual commitment to progress. The groundbreaking ceremony also aligns with the “Saudi Made” program promoted by the Local Content and Government Procurement Authority, which requires government procurement to prioritize locally manufactured products. The Smart Mobility plant will produce multiple EV charging hardware models, supported by a Charging Point Management System (CPMS) that has undergone more than six months of field testing in Saudi Arabia. Together, these developments will strengthen the Kingdom’s local supply chain and support deployments across public and commercial sectors. The ceremony also welcomed two key Public Investment Fund (PIF)–backed organizations: EVIQ (EV Infrastructure Company) and NAVA (National Automotive and Vehicles Academy), demonstrating strong governmental commitment and cross-agency support for accelerating EV infrastructure. Smart Mobility announced that three EV charging products have received SASO certification, and its CPMS is expected to begin commercial operation in the first half of 2026. The 9,490-square-meter facility is scheduled for completion in the third quarter of 2026 and, following SPARK’s required verification processes, will begin the production in the fourth quarter.
FIT Hon Teng Showcases at Hon Hai Tech Day, Demonstrating the Foxconn’s Vertical Integration Strength
Taipei / Hong Kong – November 21, 2025 – Hon Hai Tech Day will take place on November 21–22 at the Nangang Exhibition Center, spotlighting “The Real-World Applications of Hon Hai’s Three Major Intelligent Platforms Combined with AI Technologies.” The event will fully showcase the Group’s latest advances in AI innovation.
2025-11-21
Taipei / Hong Kong – November 21, 2025 – Hon Hai Tech Day will take place on November 21–22 at the Nangang Exhibition Center, spotlighting “The Real-World Applications of Hon Hai’s Three Major Intelligent Platforms Combined with AI Technologies.” The event will fully showcase the Group’s latest advances in AI innovation.
FIT Hon Teng (6088.HK), a subsidiary of Hon Hai Precision Industry Co., Ltd. (2317-TW) specializing in connector manufacturing, will present a comprehensive lineup of high-speed connectors, power solutions, and liquid-cooling technologies, highlighting the advantages of the Foxconn Group’s vertically integrated ecosystem.
This year, FIT is exhibiting high-speed server interconnects, power delivery solutions, and liquid-cooling products, including the 800V & ±400V Power Busbar for high-voltage systems, the 400A & 100A AC Whip Connectors and the 140kW LC Busbar & UQDB Floating Module for high-current applications. Among them, the 400A AC Whip Connector is the first of its kind in the market, designed to meet emerging requirements for high-power server racks. These technologies drew strong interest from leading CSP R&D teams and key customers during their debut at OCP, and FIT’s LC Busbar and Power Busbar were successfully integrated into the NVIDIA MGX showcase wall.
Hon Hai Tech Day will be held on November 21–22 at the Nangang Exhibition Center in Taipei, featuring the Group’s latest technological achievements and industry collaboration initiatives. FIT sincerely invites industry partners, media, and the public to visit the exhibition and witness the newest developments of the Hon Hai Technology ecosystem.
For more information about Hon Hai Tech Day (HHTD), please visit the official Hon Hai website: HHTD – Hon Hai Tech Day.
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com
Smart Mobility Unveils Full EV Charging Ecosystem and Signs Strategic MOU with Saudi Logistics Leader Al Bassami at Saudi Arabia’s Largest EV Auto Show
Riyadh, Saudi Arabia — October 27, 2025 — Smart Mobility, a Saudi-based joint venture between Foxconn Interconnect Technology (FIT, 6088-HK), the subsidiary of Hon Hai Technology Group. (2317-TW) and Saleh Suleiman Alrajhi & Sons, providing advanced electric vehicle (EV) charging solutions, made a strong statement at this year’s EV Auto Show Riyadh 2025, the Kingdom’s largest and most influential EV exhibition.
2025-10-27
Riyadh, Saudi Arabia — October 27, 2025 — Smart Mobility, a Saudi-based joint venture between Foxconn Interconnect Technology (FIT, 6088-HK), the subsidiary of Hon Hai Technology Group. (2317-TW) and Saleh Suleiman Alrajhi & Sons, providing advanced electric vehicle (EV) charging solutions, made a strong statement at this year’s EV Auto Show Riyadh 2025, the Kingdom’s largest and most influential EV exhibition. Smart Mobility showcased its complete AC and DC charging portfolio, alongside the first public demonstration of its Charging Point Management System (CPMS) which has undergone six months of field testing in Saudi Arabia. The company confirmed that CPMS is set for official market launch early next year, marking a major step forward in Saudi Arabia’s EV infrastructure ecosystem. A key highlight of the show was the signing of a Strategic Memorandum of Understanding (MOU) between Smart Mobility and Al Bassami Transport Group, one of the Kingdom’s most established logistics players and a leader in commercial trucking.
The agreement outlines a collaboration for EV charger installation at Al Bassami’s headquarters, followed by a comprehensive site assessment across its logistics hubs nationwide. The initiative aims to accelerate fleet electrification and establish scalable, future-ready charging networks across Saudi Arabia. The MOU was signed by Mr. Ali A. Al Bassami, CEO of Al Bassami Group, and HH Prince Fahad N. Al Saud, CEO of Smart Mobility. Speaking at the signing ceremony, HH Prince Fahad N. Al Saud addressed growing public interest in Smart Mobility’s progress toward local manufacturing under the “Saudi Made” initiative. “The factory design is now moving from the planning to the confirmation phase and will be unveiled before the end of this year,” he announced. “Our goal is to build not only products that serve Saudi needs, but a homegrown ecosystem that can compete globally.”
HH Prince Fahad also shared insights from his recent visit to Taiwan, where he attended Foxconn Interconnect Technology Tech Day and received a technology-trend briefing from the Hon Hai Research Institute. “Engaging directly with global technology leaders reaffirmed how essential cross-border collaboration is,” he said. “It’s through these exchanges that we can position Saudi innovation on the world stage.”
On the opening day of the forum at EV Auto Show, Ben Jia, Vice President of Sales at Smart Mobility, joined a panel discussion with industry leaders from Electromin, Solutions Valley, and other key Saudi EV brands to explore the Kingdom’s emerging EV charging landscape. Drawing on insights from China and Europe, Jia highlighted Smart Mobility’s product design philosophy — emphasizing durability, safety, and aesthetics for regional conditions. “When we developed the Anoles Series and the Royal Series chargers, we specifically designed them for Saudi Arabia’s high-temperature environment — ensuring thermal stability and preventing overheating issues. The products have also undergone UV testing and incorporate localized design elements,” he explained. As Saudi Arabia accelerates toward Vision 2030’s electrification goals, Smart Mobility’s participation at the EV Auto Show 2025 underscores its growing role in shaping the region’s next generation of sustainable transport infrastructure. The exhibition runs October 27–29 at the Riyadh International Convention & Exhibition Center (RICEC), where visitors can experience Smart Mobility’s latest hardware and software innovations firsthand.
OCP Global Summit 2025, FIT Unveils 224G CPC Interconnect and Advanced Thermal Management Technology
[Taipei, October 9 2025] - FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Technology Group (Foxconn, 2317-TW), will showcase its latest break throughs in high-speed data connectivity, high-power delivery, and thermal management solutions for AI data centers during the OCP Global Summit 2025, held from October 14 to 16, 2025.
[Taipei, October 9 2025] - FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Technology Group (Foxconn, 2317-TW), will showcase its latest break throughs in high-speed data connectivity, high-power delivery, and thermal management solutions for AI data centers during the OCP Global Summit 2025, held from October 14 to 16, 2025.
As the power consumption of Artificial Intelligence (AI) and high-performance computing rapidly escalates, the data center industry has reached a critical juncture in its demand for both ultra-high-speed transmission and efficient thermal dissipation. At the summit, FIT will offer a comprehensive look at its technological leap into the 224G generation through both dynamic and static demonstrations. This showcase will feature its complete AI solutions, next-generation CPC products, 224G high-speed interconnects, and 51.2T switch cooling technology.
For the first time, FIT will dynamically demonstrate its 224G OSFP Cold Plate Liquid Cooling Solution. This solution is designed to maintain server stability under extreme thermal loads while significantly boosting both power efficiency and rack density. Another key highlight is the Elevated OSFP Connector and Cage System, which ensures reliable operation for next-generation optical modules in ultra-high-speed environments through superior signal integrity and electromagnetic interference protection. FIT will also introduce its complete range of 1.6T active and passive copper cables, which strikes an optimal balance between performance, cost, and power consumption.
Furthermore, FIT will fully exhibit its deep capabilities in AI data center infrastructure, providing a solid foundation for the next generation of computing architectures. Featured exhibits will include Chip-to-Chip Connectivity Solutions such as CPU/GPU sockets, and High-Speed I/O Computing Interconnect Solutions like PCIe Gen6 high-speed connectors and cables, along with backplane connectors. The showcase will also present full-flow quick disconnect liquid cooling couplers, including the dedicated FD83 and UQD06/UQD08 connectors, emphasizing their ease of plugging/unplugging and the stable signal quality of their floating design. In the high-voltage direct current (HVDC) power domain, FIT will unveil Power Busbars and Power Cables. Complementing these are active and passive optical cables and high-end internal transmission cables, delivering a comprehensive high-speed transmission solution from internal components to external connections.
During the event, Terry Little of FIT and Intel will co-present a Keynote Speech on October 16 titled “SI in Immersion Cooling Technology”. This in-depth presentation will further underscore FIT’s pivotal role and technological influence within the industry ecosystem.
FIT's strategy extends beyond individual products. It focuses on responding to market needs with complete solutions to build the cornerstone of next-generation AI computing. This positioning signifies that FIT is more than a product supplier. It is a key enabler driving enhanced data center efficiency and energy sustainability. We are committed to collaborating with all excellent industry partners to build a superior supply chain.
Attendees are invited to visit Suite 826 at the Hilton San Jose to experience FIT’s latest achievements firsthand.
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com
About OCP Global Summit
The OCP Global Summit offers a unique platform for the worldwide community to share insights, foster collaboration, and showcase cutting-edge advancements in open hardware and software. It is dedicated to driving openness, efficiency, sustainability, scalability, and growth within the data center and edge technology ecosystems.
Media Contact: Email: fit-ir@fit-foxconn.com
Product and Service Inquiries: Europe and America Contact: sales-usa@fit- foxconn.com
Voltaira Group Expands SASO-Certified Portfolio with Royal Series AC Charger, Strengthening FIT's Position in the MENA MarketKSA, Riyadh — 2025.7.21
Foxconn Interconnect Technology (FIT, 6088-HK), a subsidiary of Hon Hai Precision Industry Co., Ltd. (2317-TW), is continuing to gain momentum in the Middle East with its electric vehicle (EV) charging business.
2025-07-21
Foxconn Interconnect Technology (FIT, 6088-HK), a subsidiary of Hon Hai Precision Industry Co., Ltd. (2317-TW), is continuing to gain momentum in the Middle East with its electric vehicle (EV) charging business.
Voltaira, FIT’s global one-mobility brand, has announced that its Royal Series AC Charger has officially received SASO certification, reinforcing the brand’s commitment to excellence and compliance in the Kingdom of Saudi Arabia.
This achievement comes on the heels of a series of strategic developments. In May, FIT announced the formation of its joint venture Smart Mobility, based in Riyadh, to drive localized operations in the region. Smart Mobility’s first launch of products — including the Voltaira Anoles Series AC Charger, a recipient of the iF Design Award, and the high-power Voltaira SE DC Charger — have already been successfully deployed and tested in Saudi Arabia, with both products also receiving SASO certification.
The Anoles Series AC Charger has received strong market interest, with early orders secured shortly after launch, signaling a clear product-market fit in the region. In parallel, the Voltaira SE DC Charger has been invited for operational use at serval prominent Government locations, a testament to its high-performance reputation and compliance with public sector standards. Furthermore, trial operations of Smart Mobility’s Charging Point Management System (CPMS) have officially commenced — marking a critical milestone in Voltaira’s move toward delivering not just hardware, but complete smart mobility solutions tailored for the MENA region.
The newly certified Royal Series AC Charger further exemplifies FIT’s design and engineering capabilities. Purpose-built for the MENA region, the Royal Series features bold geometric aesthetics, a refined black-and-gold finish, and a signature gold cable hook that elegantly manages the 7-meter charging cable — an embodiment of user-centric design, performance, and regional sophistication.
Offered in 7, 11, and 22 kW configurations, the Royal AC Charger adds to Voltaira’s growing portfolio of premium AC and DC charging solutions tailored for the region’s unique environmental, cultural, and functional requirements.
With multiple iF Design Awards and Red Dot recognitions, FIT’s in-house design team continues to deliver world-class hardware that meets and exceeds the region’s high expectations on performance, aesthetics, and quality.
Looking ahead, FIT Group is actively preparing for the next phase of localization — a planned Smart Mobility manufacturing facility in Saudi Arabia, supporting the Kingdom’s Saudi Made vision. This move will not only enable faster deployment and tailored production but also demonstrate FIT’s long-term commitment to building local value chains in support of Vision 2030.
“The Royal Series is more than a product launch; it’s a validation of our MENA-specific design strategy and a signal of FIT’s long-term intent in the region,” said Waheed Khairy, Chief Sales Officer at Smart Mobility. “With our SASO-certified portfolio and plans for local manufacturing underway, we’re positioning Smart Mobility as a key contributor to Saudi Arabia’s EV charging ecosystem.”
About FIT Hon Teng Foxconn Interconnect Technology (FIT) is a leading global solutions developer and manufacturer, cultivating connectivity for a better world. With unsurpassed capabilities in development, research, manufacturing engineering and design, production, supply chain, and go-to-market planning for world class brands and private label products spanning B2C and B2B categories, FIT is at the forefront of worldwide technological trends delivering compelling user experiences at scale. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components. For more information, visit FIT’s website: https://www.fit-foxconn.com.
