Smart Mobility Unveils Full EV Charging Ecosystem and Signs Strategic MOU with Saudi Logistics Leader Al Bassami at Saudi Arabia’s Largest EV Auto Show
Riyadh, Saudi Arabia — October 27, 2025 — Smart Mobility, a Saudi-based joint venture between Foxconn Interconnect Technology (FIT, 6088-HK), the subsidiary of Hon Hai Technology Group. (2317-TW) and Saleh Suleiman Alrajhi & Sons, providing advanced electric vehicle (EV) charging solutions, made a strong statement at this year’s EV Auto Show Riyadh 2025, the Kingdom’s largest and most influential EV exhibition.
2025-10-27
Riyadh, Saudi Arabia — October 27, 2025 — Smart Mobility, a Saudi-based joint venture between Foxconn Interconnect Technology (FIT, 6088-HK), the subsidiary of Hon Hai Technology Group. (2317-TW) and Saleh Suleiman Alrajhi & Sons, providing advanced electric vehicle (EV) charging solutions, made a strong statement at this year’s EV Auto Show Riyadh 2025, the Kingdom’s largest and most influential EV exhibition. Smart Mobility showcased its complete AC and DC charging portfolio, alongside the first public demonstration of its Charging Point Management System (CPMS) which has undergone six months of field testing in Saudi Arabia. The company confirmed that CPMS is set for official market launch early next year, marking a major step forward in Saudi Arabia’s EV infrastructure ecosystem. A key highlight of the show was the signing of a Strategic Memorandum of Understanding (MOU) between Smart Mobility and Al Bassami Transport Group, one of the Kingdom’s most established logistics players and a leader in commercial trucking.
The agreement outlines a collaboration for EV charger installation at Al Bassami’s headquarters, followed by a comprehensive site assessment across its logistics hubs nationwide. The initiative aims to accelerate fleet electrification and establish scalable, future-ready charging networks across Saudi Arabia. The MOU was signed by Mr. Ali A. Al Bassami, CEO of Al Bassami Group, and HH Prince Fahad N. Al Saud, CEO of Smart Mobility. Speaking at the signing ceremony, HH Prince Fahad N. Al Saud addressed growing public interest in Smart Mobility’s progress toward local manufacturing under the “Saudi Made” initiative. “The factory design is now moving from the planning to the confirmation phase and will be unveiled before the end of this year,” he announced. “Our goal is to build not only products that serve Saudi needs, but a homegrown ecosystem that can compete globally.”
HH Prince Fahad also shared insights from his recent visit to Taiwan, where he attended Foxconn Interconnect Technology Tech Day and received a technology-trend briefing from the Hon Hai Research Institute. “Engaging directly with global technology leaders reaffirmed how essential cross-border collaboration is,” he said. “It’s through these exchanges that we can position Saudi innovation on the world stage.”
On the opening day of the forum at EV Auto Show, Ben Jia, Vice President of Sales at Smart Mobility, joined a panel discussion with industry leaders from Electromin, Solutions Valley, and other key Saudi EV brands to explore the Kingdom’s emerging EV charging landscape. Drawing on insights from China and Europe, Jia highlighted Smart Mobility’s product design philosophy — emphasizing durability, safety, and aesthetics for regional conditions. “When we developed the Anoles Series and the Royal Series chargers, we specifically designed them for Saudi Arabia’s high-temperature environment — ensuring thermal stability and preventing overheating issues. The products have also undergone UV testing and incorporate localized design elements,” he explained. As Saudi Arabia accelerates toward Vision 2030’s electrification goals, Smart Mobility’s participation at the EV Auto Show 2025 underscores its growing role in shaping the region’s next generation of sustainable transport infrastructure. The exhibition runs October 27–29 at the Riyadh International Convention & Exhibition Center (RICEC), where visitors can experience Smart Mobility’s latest hardware and software innovations firsthand.
OCP Global Summit 2025, FIT Unveils 224G CPC Interconnect and Advanced Thermal Management Technology
[Taipei, October 9 2025] - FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Technology Group (Foxconn, 2317-TW), will showcase its latest break throughs in high-speed data connectivity, high-power delivery, and thermal management solutions for AI data centers during the OCP Global Summit 2025, held from October 14 to 16, 2025.
[Taipei, October 9 2025] - FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Technology Group (Foxconn, 2317-TW), will showcase its latest break throughs in high-speed data connectivity, high-power delivery, and thermal management solutions for AI data centers during the OCP Global Summit 2025, held from October 14 to 16, 2025.
As the power consumption of Artificial Intelligence (AI) and high-performance computing rapidly escalates, the data center industry has reached a critical juncture in its demand for both ultra-high-speed transmission and efficient thermal dissipation. At the summit, FIT will offer a comprehensive look at its technological leap into the 224G generation through both dynamic and static demonstrations. This showcase will feature its complete AI solutions, next-generation CPC products, 224G high-speed interconnects, and 51.2T switch cooling technology.
For the first time, FIT will dynamically demonstrate its 224G OSFP Cold Plate Liquid Cooling Solution. This solution is designed to maintain server stability under extreme thermal loads while significantly boosting both power efficiency and rack density. Another key highlight is the Elevated OSFP Connector and Cage System, which ensures reliable operation for next-generation optical modules in ultra-high-speed environments through superior signal integrity and electromagnetic interference protection. FIT will also introduce its complete range of 1.6T active and passive copper cables, which strikes an optimal balance between performance, cost, and power consumption.
Furthermore, FIT will fully exhibit its deep capabilities in AI data center infrastructure, providing a solid foundation for the next generation of computing architectures. Featured exhibits will include Chip-to-Chip Connectivity Solutions such as CPU/GPU sockets, and High-Speed I/O Computing Interconnect Solutions like PCIe Gen6 high-speed connectors and cables, along with backplane connectors. The showcase will also present full-flow quick disconnect liquid cooling couplers, including the dedicated FD83 and UQD06/UQD08 connectors, emphasizing their ease of plugging/unplugging and the stable signal quality of their floating design. In the high-voltage direct current (HVDC) power domain, FIT will unveil Power Busbars and Power Cables. Complementing these are active and passive optical cables and high-end internal transmission cables, delivering a comprehensive high-speed transmission solution from internal components to external connections.
During the event, Terry Little of FIT and Intel will co-present a Keynote Speech on October 16 titled “SI in Immersion Cooling Technology”. This in-depth presentation will further underscore FIT’s pivotal role and technological influence within the industry ecosystem.
FIT's strategy extends beyond individual products. It focuses on responding to market needs with complete solutions to build the cornerstone of next-generation AI computing. This positioning signifies that FIT is more than a product supplier. It is a key enabler driving enhanced data center efficiency and energy sustainability. We are committed to collaborating with all excellent industry partners to build a superior supply chain.
Attendees are invited to visit Suite 826 at the Hilton San Jose to experience FIT’s latest achievements firsthand.
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com
About OCP Global Summit
The OCP Global Summit offers a unique platform for the worldwide community to share insights, foster collaboration, and showcase cutting-edge advancements in open hardware and software. It is dedicated to driving openness, efficiency, sustainability, scalability, and growth within the data center and edge technology ecosystems.
Media Contact: Email: fit-ir@fit-foxconn.com
Product and Service Inquiries: Europe and America Contact: sales-usa@fit- foxconn.com
Voltaira Group Expands SASO-Certified Portfolio with Royal Series AC Charger, Strengthening FIT's Position in the MENA MarketKSA, Riyadh — 2025.7.21
Foxconn Interconnect Technology (FIT, 6088-HK), a subsidiary of Hon Hai Precision Industry Co., Ltd. (2317-TW), is continuing to gain momentum in the Middle East with its electric vehicle (EV) charging business.
2025-07-21
Foxconn Interconnect Technology (FIT, 6088-HK), a subsidiary of Hon Hai Precision Industry Co., Ltd. (2317-TW), is continuing to gain momentum in the Middle East with its electric vehicle (EV) charging business.
Voltaira, FIT’s global one-mobility brand, has announced that its Royal Series AC Charger has officially received SASO certification, reinforcing the brand’s commitment to excellence and compliance in the Kingdom of Saudi Arabia.
This achievement comes on the heels of a series of strategic developments. In May, FIT announced the formation of its joint venture Smart Mobility, based in Riyadh, to drive localized operations in the region. Smart Mobility’s first launch of products — including the Voltaira Anoles Series AC Charger, a recipient of the iF Design Award, and the high-power Voltaira SE DC Charger — have already been successfully deployed and tested in Saudi Arabia, with both products also receiving SASO certification.
The Anoles Series AC Charger has received strong market interest, with early orders secured shortly after launch, signaling a clear product-market fit in the region. In parallel, the Voltaira SE DC Charger has been invited for operational use at serval prominent Government locations, a testament to its high-performance reputation and compliance with public sector standards. Furthermore, trial operations of Smart Mobility’s Charging Point Management System (CPMS) have officially commenced — marking a critical milestone in Voltaira’s move toward delivering not just hardware, but complete smart mobility solutions tailored for the MENA region.
The newly certified Royal Series AC Charger further exemplifies FIT’s design and engineering capabilities. Purpose-built for the MENA region, the Royal Series features bold geometric aesthetics, a refined black-and-gold finish, and a signature gold cable hook that elegantly manages the 7-meter charging cable — an embodiment of user-centric design, performance, and regional sophistication.
Offered in 7, 11, and 22 kW configurations, the Royal AC Charger adds to Voltaira’s growing portfolio of premium AC and DC charging solutions tailored for the region’s unique environmental, cultural, and functional requirements.
With multiple iF Design Awards and Red Dot recognitions, FIT’s in-house design team continues to deliver world-class hardware that meets and exceeds the region’s high expectations on performance, aesthetics, and quality.
Looking ahead, FIT Group is actively preparing for the next phase of localization — a planned Smart Mobility manufacturing facility in Saudi Arabia, supporting the Kingdom’s Saudi Made vision. This move will not only enable faster deployment and tailored production but also demonstrate FIT’s long-term commitment to building local value chains in support of Vision 2030.
“The Royal Series is more than a product launch; it’s a validation of our MENA-specific design strategy and a signal of FIT’s long-term intent in the region,” said Waheed Khairy, Chief Sales Officer at Smart Mobility. “With our SASO-certified portfolio and plans for local manufacturing underway, we’re positioning Smart Mobility as a key contributor to Saudi Arabia’s EV charging ecosystem.”
About FIT Hon Teng Foxconn Interconnect Technology (FIT) is a leading global solutions developer and manufacturer, cultivating connectivity for a better world. With unsurpassed capabilities in development, research, manufacturing engineering and design, production, supply chain, and go-to-market planning for world class brands and private label products spanning B2C and B2B categories, FIT is at the forefront of worldwide technological trends delivering compelling user experiences at scale. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components. For more information, visit FIT’s website: https://www.fit-foxconn.com.
Phyn Acquired by Investment Group Led by Property Brothers’ Jonathan Scott to Accelerate Growth in Smart Water Solutions
LOS ANGELES – TBC – Phyn, the industry leader in intelligent water solutions, has been acquired by a powerhouse group of investors led by entrepreneur and television personality Jonathan Scott. This strategic acquisition transitions Phyn from Belkin’s ownership to a newly independent company backed by a high-profile group of investors with deep experience in technology, real estate and entertainment – united in their vision to make Phyn’s category-defining solutions a standard in every home and building.
2025-05-23
The move marks a pivotal new chapter for Phyn, positioning the company for rapid expansion, heightened consumer awareness and deeper adoption across key market verticals including insurance, property management, building, utilities and home services. The investor group includes:
● Jonathan Scott, co-founder of Scott Brothers Global and producer/host of The Property Brothers on HGTV, brings brand-building expertise and a personal passion for smart home innovation. ● Tom Proulx, co-founder of Intuit and creator of Quicken, will serve as an advisor and board member, lending his decades of experience in software development and building consumer-focused technology brands. ● David Marquardt, one of Silicon Valley’s most respected venture capitalists and a founding investor in Microsoft, brings deep expertise in scaling transformative tech companies. ● ICON Builders, led by Allen “Kelly” Sands, is a national leader in multifamily development. A longtime Phyn customer, ICON will play a critical role in helping to expand Phyn’s reach across the builder and multifamily sectors.
“As someone who’s renovated more than a thousand homes, I’ve seen the damage a hidden leak can cause,” said Jonathan Scott. “I’ve used Phyn in my own homes for years, and it’s hands-down the best smart water tech on the market. It’s reliable, easy to use, and does more than any other system to accurately detect and stop damage before it starts. This is the kind of technology I believe every homeowner deserves, and I’m excited to actively support Phyn in becoming a household name and protecting homes everywhere.
“This marks a transformative milestone for Phyn,” said Ryan Kim, CEO of Phyn. “We’re thrilled to have the backing of such an accomplished and visionary group of investors who have built iconic brands and scaled companies to global prominence. Their belief in Phyn underscores the strength of our mission, market-leading technology and solutions. With their strategic support, we’re poised to accelerate our growth, elevate consumer awareness, and bring peace of mind to more households worldwide by stopping catastrophic losses from water damage.”
The timing of the investment comes as smart water management becomes a must-have. Water damage is now a leading cause of property insurance claims, costing billions annually. Insurers, municipalities and homebuilders are responding with policies and programs that require or incentivize leak detection devices, particularly those with automatic shutoff capabilities like Phyn. The company’s vast partner network includes leading insurance providers, utilities and municipalities including Nationwide, Chubb, PURE, Cincinnati Financial, Iplex Australia among many others. In a multi-year study of 13,500 homes, Phyn-protected households were shown to be 99% less likely to experience a non-weather water leak claim, underscoring the company’s impact on both home safety and insurance risk mitigation.
Phyn is a category leader in intelligent water solutions, offering a suite of award-winning products ranging from the DIY-installed Phyn Smart Water Assistant and Smart Water Sensor to the professionally installed Phyn Plus with a built-in shutoff valve. At the core of Phyn is its proprietary fusion of ultrasonic flow sensing, HD pressure wave analysis and industry-leading AI that delivers unmatched accuracy and continues to set the benchmark for the industry. With this new structure, Phyn gains not only financial resources, but also an elite network of advisors and operators to accelerate growth across key consumer and B2B channels.
About Phyn Phyn is the leading intelligent water brand, bringing solutions to market that help people protect their homes, conserve water and save money. Built upon nearly a decade of research and patented technological innovation, Phyn is poised to change the way consumers interact with water and help solve the major challenges threatening the world's supply of clean, healthy water. Phyn has been widely recognized for its innovation, including honors from the Red Dot Awards, SXSW Innovation Awards, Core 77 Design Awards, IoT World Awards, CES Innovation Awards and GreenBuilder's Sustainability Awards, among others. To learn more, visit www.phyn.com.
San Jose, California – May 13, 2025 – Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, is proud to announce its continued support for Broadcom’s co-packaged optics (CPO) initiative. FIT is now delivering key hardware components that are integral to the success of Broadcom’s Tomahawk 5 (TH5) Bailly platform, including advanced solderless LGA-to-LGA sockets and Remote Pluggable Laser Source (PLS) I/O cages, alongside specialized connector assemblies.
2025-05-13
San Jose, California – May 13, 2025 – Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, is proud to announce its continued support for Broadcom’s co-packaged optics (CPO) initiative. FIT is now delivering key hardware components that are integral to the success of Broadcom’s Tomahawk 5 (TH5) Bailly platform, including advanced solderless LGA-to-LGA sockets and Remote Pluggable Laser Source (PLS) I/O cages, alongside specialized connector assemblies. These critical CPO components, now in full-scale production, are designed to meet the demanding performance, scalability, and integration requirements of next-generation data center optical architectures. With their superior design, FIT’s solutions enable seamless system integration, simplified assembly, and long-term maintainability. Precision Interconnect Solutions for Advanced Data Center Networks FIT’s high-performance, solderless LGA-to-LGA sockets provide a simplified yet robust solution for integrating Broadcom’s switch ASICs into high-density systems. This innovation eliminates the need for traditional soldering, enabling faster and more flexible assembly while ensuring consistent yield and reliability. The solderless connection also ensures the stability and scalability of data center deployments as optical networks evolve. Additionally, FIT’s PLS I/O cages and connector assemblies are engineered to withstand the thermal and mechanical challenges of high-speed optical environments. These components play a critical role in Broadcom’s vision for laser-disaggregated switch architectures, enabling significant power savings, bandwidth density, and performance scaling for hyperscale data centers. Broadcom: A Trusted Partner in CPO Innovation “We are proud to partner with Foxconn Interconnect Technology as a key enabler in the advancement of the TH5-Bailly CPO platform,” said Alvin Low, Director of Silicon Photonics Engineering, Optical Systems Division, Broadcom. “FIT’s expertise in precision interconnects and system integration is essential to the successful scale-out of our CPO technology in hyperscale environments. Their innovative components are central to the continued evolution of data center optical networking.” Looking Ahead: Collaborating on Next-Generation CPO Platforms FIT’s role extends beyond the current phase, as the company is actively involved in developing next-generation 200-Gbps per lane CPO platform components. By leveraging FIT’s deep expertise in socket design, optical I/O, and mechanical systems, the two companies are committed to addressing the rapidly growing demands of AI and high-performance computing (HPC) workloads.
"We are proud to partner with Foxconn Interconnect Technology as a key enabler in the advancement of the TH5-Bailly CPO platform," said Alvin Low, Director of Silicon Photonics Engineering, Optical Systems Division, Broadcom. "FIT's expertise in precision interconnects and system integration is essential to the successful scale-out of our CPO technology in hyperscale environments. Their innovative components are central to the continued evolution of data center optical networking."
Looking Ahead: Collaborating on Next-Generation CPO Platforms
FIT's role extends beyond the current phase, as the company is actively involved in developing next-generation 200-Gbps per lane CPO platform components. By leveraging FIT's deep expertise in socket design, optical I/O, and mechanical systems, the two companies are committed to addressing the rapidly growing demands of AI and high-performance computing (HPC) workloads.
"We are proud to partner with Foxconn Interconnect Technology as a key enabler in the advancement of the TH5-Bailly CPO platform," said Alvin Low, Director of Silicon Photonics Engineering, Optical Systems Division, Broadcom. "FIT's expertise in precision interconnects and system integration is essential to the successful scale-out of our CPO technology in hyperscale environments. Their innovative components are central to the continued evolution of data center optical networking."
"We are excited to our collaboration with Boardcom to shape the next-generation of 200G CPO solutions," said Alex An, Senior Director of Business Development, Foxconn Interconnect Technology. "Together, we are focused on enabling scalable AI infrastructure with cutting-edge interconnect solutions that combine reliability, power efficiency, and forward-thinking design."
Showcasing the Future of CPO Technology at Computex 2025 As part of their continued partnership, FIT will be showcasing illustrative samples of the LGA sockets and I/O modules at Computex 2025. These innovative solutions will be available for qualified platform developers looking to build the next-generation of AI-driven data center infrastructure.
Smart Mobility Launched by FIT and Saleh Suleiman Alrajhi & Sons to Seize Strategic Position in Saudi EV Charging Market
Following the joint venture announcement in October 2024 witnessed by the Saudi Minister of Energy, Hon Hai Precision Industry Co., Ltd. (2317-TW) and its subsidiary Foxconn Interconnect Technology (FIT, 6088-HK), together with Saleh Suleiman Alrajhi & Sons (Alrajhi), today officially launched the joint venture company **Smart Mobility** at the “EV in Saudi” exhibition in Riyadh.
2025-05-05
Following the joint venture announcement in October 2024 witnessed by the Saudi Minister of Energy, Hon Hai Precision Industry Co., Ltd. (2317-TW) and its subsidiary Foxconn Interconnect Technology (FIT, 6088-HK), together with Saleh Suleiman Alrajhi & Sons (Alrajhi), today officially launched the joint venture company **Smart Mobility** at the “EV in Saudi” exhibition in Riyadh.
Smart Mobility introduces its first product line under the Voltaira brand of EV chargers. Among them, the AC Anoles Series has received SASO certification—a key regulatory requirement for EV chargers in Saudi Arabia. Known for its exceptional heat resistance, the series also received the prestigious iF Design Award in Germany. Also showcased at the event are the Royal Series DC and AC chargers, featuring high specifications and elegant designs tailored specifically for the Saudi market.
Bernadett Torok, Global Head of Brand Communication at Voltaira’s headquarters in Germany, attended the launch and remarked,“Voltaira is proudly rooted in Germany, with a focus on automotive technology innovation and global sales. Under the FIT ‘One Mobility’ strategy, we are honored to bring our solutions to the Middle East. Our integrated energy storage solutions will also be featured at The Smarter E Europe exhibition in Munich on May 7. Saudi Arabia’s solar advantage and growing storage ecosystem will be essential to accelerating its green transition.”
HH Prince Fahad bin Nawaf Al Saud, CEO of Smart Mobility, stated, “FIT’s strength in automotive technology and manufacturing spans over 30 countries. This joint venture comes at a pivotal time as Saudi Arabia advances its energy transition and localization strategies. We expect a compound annual growth rate (CAGR) of over 28% in the domestic EV market by 2030. Smart Mobility will move forward steadily, fully aligned with the ‘Saudi Made’ initiative to drive local manufacturing toward global competitiveness.”
Louie Yeh, COO of Smart Mobility, added that this venture is a key milestone in FIT’s energy strategy and a demonstration of its long-term commitment to the Saudi market. “In the first year, Smart Mobility has completed development for both residential and public charging product lines. We are also preparing to launch a localized CPMS (Charging Platform Management System) to enhance data analytics and user experience. Under the leadership of HH Prince Fahad, a pivotal figure in Saudi’s renewable energy transition, we are confident in growing with the market.”
Mai Alzamil, CFO and Board Director at Alrajhi Group, noted, “Following the signing of the joint venture, FIT was invited by government leadership to install Voltaira DC charging infrastructure at a key government facility—an honor that reflects both technical recognition and the government’s trust in the partnership. This symbolic gesture, jointly executed with local strategic partner Turning Point Renewable Energy (TPRE), reinforces our commitment to Vision 2030 and shared social responsibility.”
TPRE, the leading brand in Saudi Arabia’s home AC charger market, will serve as a key local partner. Mohamed Aleraij, Board Director of Smart Mobility, commented,“Our collaboration with TPRE spans product promotion, distribution, installation, and after-sales service. Leveraging their local resources and technical network will significantly accelerate our product rollout and service implementation—enhancing the overall user experience.”
This strategic partnership solidifies Smart Mobility’s position in the Saudi market and lays the groundwork for nationwide expansion. With strong government momentum behind energy transition and local manufacturing, Smart Mobility and TPRE are jointly building a user-centric, high-efficiency charging ecosystem—injecting new momentum into the Kingdom’s Vision 2030 for sustainable transportation.
Foxconn Interconnect Technology Showcases PCIe6 and PCIe7 with Alphawave Semi at DesignCon 2025.
Santa Clara, Calif., January 28, 2025 -- Foxconn Interconnect Technology (6088.HK) (“FIT”), a leading connective solution provider creating powerful connections for a better world, today announced the demonstration of it’s PCI Express® (PCIe®) 6.0 signal transmission through their CDFP SMT connector with a Passive DAC cable and also PCIe 7.0®-capable transmission through their OSFP-XD SMT connector with a Passive DAC cable at the DesignCon 2025 exhibition in Santa Clara, California from January 28th to January 30th, 2025.
2025-01-28
Foxconn Interconnect Technology Showcases PCIe6 and PCIe7 with Alphawave Semi at DesignCon 2025. Santa Clara, Calif., January 28, 2025 -- Foxconn Interconnect Technology (6088.HK) (“FIT”), a leading connective solution provider creating powerful connections for a better world, today announced the demonstration of it’s PCI Express® (PCIe®) 6.0 signal transmission through their CDFP SMT connector with a Passive DAC cable and also PCIe 7.0®-capable transmission through their OSFP-XD SMT connector with a Passive DAC cable at the DesignCon 2025 exhibition in Santa Clara, California from January 28th to January 30th, 2025. FIT’s own CDFP SMT connector and Passive DAC cable will appear together with Alphawave Semi’s 64 GT/ PCIe 6.0® Subsystem for Disaggregated Networks. Alphawave Semi’s PipeCORE? is their PCIe 6.0 Subsystem IP Supporting CDFP PCIe Direct Attach Cabling which will enable the industry to make the move to disaggregated server resources within a data center rack. Alphawave Semi’s complete PCIe 6.0® subsystem solution is supporting FIT’s CDFP PCIe Direct Attach Cables and delivering a max reach of 4 meters. This advanced integration leverages Alphawave Semi's sophisticated controller IP and top-tier PAM4 SerDes PHY, delivering unmatched performance at the lowest power and lowest latency channel solution. Witness how these combined technologies redefine connectivity and throughput in cutting-edge data centers, setting new standards for the PCIe 6.0® ecosystem and PCI-SIG’s CopprLink. In addition, FIT’s own OSFP-XD SMT connector and Passive DAC cable will appear together with Alphawave Semi’s 128 GT/ PCIe 7.0® Performance System for Scale Up Networks. Alphawave Semi’s PipeCORE? is their PCIe 7.0® IP Supporting OSFP-XD PCIe Direct Attach Cabling which will enable the industry to make the move to high-speed, high bandwidth-density scale up resources within a data center rack, Alphawave Semi’s PCIe 7.0® solution leveraging our industry pioneering 112G DSP-based SerDes, are already here supporting FIT’s OSFP-XD PCIe Direct Attach Cables and delivering a max reach of 2 meters, ideal for scale-up networks. This advanced integration leverages Alphawave Semi's top-tier PAM4 SerDes PHY, delivering unmatched performance at the lowest power and lowest latency channel solution. Highly correlated models with in-lab measurements enable fast to market, complete solutions at 128 Gbps. Applications: ‧ Telecom/High-Performance Computing Systems ‧ Data Center Switches, Routers and Servers Configurations to accommodate 112 Gbps and PCIe 6.0® and 7.0®
Protocols Supported: ‧ IEEE 802.3ck ‧ IEEE 802.3dj (in progress) ‧ OSFP-XD MSA specification ‧ PCIe Gen6 and Gen7 ecosystem ‧ PCI-SIG CopprLink specification ‧ CXL Standard
About FIT Hon Teng Foxconn Interconnect Technology (FIT) is a leading global solutions developer and manufacturer, cultivating connectivity for a better world. With unsurpassed capabilities in development, research, manufacturing engineering and design, production, supply chain, and go-to-market planning for world class brands and private label products spanning B2C and B2B categories, FIT is at the forefront of worldwide technological trends delivering compelling user experiences at scale. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components. For more information, visit FIT’s website: https://www.fit-foxconn.com.
News Contact: EMAIL: fit-ir@fit-foxconn.com Product Service Contact: USA region EMAIL: sales-usa@fit-foxconn.com
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