Foxconn Interconnect Technology (FIT, 6088-HK), a subsidiary of Hon Hai Precision Industry Co., Ltd. (2317-TW), is continuing to gain momentum in the Middle East with its electric vehicle (EV) charging business.

Voltaira, FIT’s global one-mobility brand, has announced that its Royal Series AC Charger has officially received SASO certification, reinforcing the brand’s commitment to excellence and compliance in the Kingdom of Saudi Arabia.

This achievement comes on the heels of a series of strategic developments. In May, FIT announced the formation of its joint venture Smart Mobility, based in Riyadh, to drive localized operations in the region. Smart Mobility’s first launch of products — including the Voltaira Anoles Series AC Charger, a recipient of the iF Design Award, and the high-power Voltaira SE DC Charger — have already been successfully deployed and tested in Saudi Arabia, with both products also receiving SASO certification.

The Anoles Series AC Charger has received strong market interest, with early orders secured shortly after launch, signaling a clear product-market fit in the region. In parallel, the Voltaira SE DC Charger has been invited for operational use at serval prominent Government locations, a testament to its high-performance reputation and compliance with public sector standards. Furthermore, trial operations of Smart Mobility’s Charging Point Management System (CPMS) have officially commenced — marking a critical milestone in Voltaira’s move toward delivering not just hardware, but complete smart mobility solutions tailored for the MENA region.

The newly certified Royal Series AC Charger further exemplifies FIT’s design and engineering capabilities. Purpose-built for the MENA region, the Royal Series features bold geometric aesthetics, a refined black-and-gold finish, and a signature gold cable hook that elegantly manages the 7-meter charging cable — an embodiment of user-centric design, performance, and regional sophistication.

Offered in 7, 11, and 22 kW configurations, the Royal AC Charger adds to Voltaira’s growing portfolio of premium AC and DC charging solutions tailored for the region’s unique environmental, cultural, and functional requirements.

With multiple iF Design Awards and Red Dot recognitions, FIT’s in-house design team continues to deliver world-class hardware that meets and exceeds the region’s high expectations on performance, aesthetics, and quality.

Looking ahead, FIT Group is actively preparing for the next phase of localization — a planned Smart Mobility manufacturing facility in Saudi Arabia, supporting the Kingdom’s Saudi Made vision. This move will not only enable faster deployment and tailored production but also demonstrate FIT’s long-term commitment to building local value chains in support of Vision 2030.

“The Royal Series is more than a product launch; it’s a validation of our MENA-specific design strategy and a signal of FIT’s long-term intent in the region,” said Waheed Khairy, Chief Sales Officer at Smart Mobility. “With our SASO-certified portfolio and plans for local manufacturing underway, we’re positioning Smart Mobility as a key contributor to Saudi Arabia’s EV charging ecosystem.”

About FIT Hon Teng
Foxconn Interconnect Technology (FIT) is a leading global solutions developer and manufacturer, cultivating connectivity for a better world. With unsurpassed capabilities in development, research, manufacturing engineering and design, production, supply chain, and go-to-market planning for world class brands and private label products spanning B2C and B2B categories, FIT is at the forefront of worldwide technological trends delivering compelling user experiences at scale. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components. For more information, visit FIT’s website: https://www.fit-foxconn.com.

News Contact:
EMAIL: fit-ir@fit-foxconn.com

The move marks a pivotal new chapter for Phyn, positioning the company for rapid expansion, heightened consumer awareness and deeper adoption across key market verticals including insurance, property management, building, utilities and home services. The investor group includes:

● Jonathan Scott, co-founder of Scott Brothers Global and producer/host of The Property Brothers on HGTV, brings brand-building expertise and a personal passion for smart home innovation.
● Tom Proulx, co-founder of Intuit and creator of Quicken, will serve as an advisor and board member, lending his decades of experience in software development and building consumer-focused technology brands.
● David Marquardt, one of Silicon Valley’s most respected venture capitalists and a founding investor in Microsoft, brings deep expertise in scaling transformative tech companies.
● ICON Builders, led by Allen “Kelly” Sands, is a national leader in multifamily development. A longtime Phyn customer, ICON will play a critical role in helping to expand Phyn’s reach across the builder and multifamily sectors.

“As someone who’s renovated more than a thousand homes, I’ve seen the damage a hidden leak can cause,” said Jonathan Scott. “I’ve used Phyn in my own homes for years, and it’s hands-down the best smart water tech on the market. It’s reliable, easy to use, and does more than any other system to accurately detect and stop damage before it starts. This is the kind of technology I believe every homeowner deserves, and I’m excited to actively support Phyn in becoming a household name and protecting homes everywhere.

“This marks a transformative milestone for Phyn,” said Ryan Kim, CEO of Phyn. “We’re thrilled to have the backing of such an accomplished and visionary group of investors who have built iconic brands and scaled companies to global prominence. Their belief in Phyn underscores the strength of our mission, market-leading technology and solutions. With their strategic support, we’re poised to accelerate our growth, elevate consumer awareness, and bring peace of mind to more households worldwide by stopping catastrophic losses from water damage.”

The timing of the investment comes as smart water management becomes a must-have. Water damage is now a leading cause of property insurance claims, costing billions annually. Insurers, municipalities and homebuilders are responding with policies and programs that require or incentivize leak detection devices, particularly those with automatic shutoff capabilities like Phyn. The company’s vast partner network includes leading insurance providers, utilities and municipalities including Nationwide, Chubb, PURE, Cincinnati Financial, Iplex Australia among many others. In a multi-year study of 13,500 homes, Phyn-protected households were shown to be 99% less likely to experience a non-weather water leak claim, underscoring the company’s impact on both home safety and insurance risk mitigation.

Phyn is a category leader in intelligent water solutions, offering a suite of award-winning products ranging from the DIY-installed Phyn Smart Water Assistant and Smart Water Sensor to the professionally installed Phyn Plus with a built-in shutoff valve. At the core of Phyn is its proprietary fusion of ultrasonic flow sensing, HD pressure wave analysis and industry-leading AI that delivers unmatched accuracy and continues to set the benchmark for the industry. With this new structure, Phyn gains not only financial resources, but also an elite network of advisors and operators to accelerate growth across key consumer and B2B channels.

About Phyn
Phyn is the leading intelligent water brand, bringing solutions to market that help people protect their homes, conserve water and save money. Built upon nearly a decade of research and patented technological innovation, Phyn is poised to change the way consumers interact with water and help solve the major challenges threatening the world's supply of clean, healthy water. Phyn has been widely recognized for its innovation, including honors from the Red Dot Awards, SXSW Innovation Awards, Core 77 Design Awards, IoT World Awards, CES Innovation Awards and GreenBuilder's Sustainability Awards, among others. To learn more, visit www.phyn.com.


Media Contacts

Phyn:
Debra Benson
phyn@illumepr.com

San Jose, California – May 13, 2025 – Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, is proud to announce its continued support for Broadcom’s co-packaged optics (CPO) initiative. FIT is now delivering key hardware components that are integral to the success of Broadcom’s Tomahawk 5 (TH5) Bailly platform, including advanced solderless LGA-to-LGA sockets and Remote Pluggable Laser Source (PLS) I/O cages, alongside specialized connector assemblies.
These critical CPO components, now in full-scale production, are designed to meet the demanding performance, scalability, and integration requirements of next-generation data center optical architectures. With their superior design, FIT’s solutions enable seamless system integration, simplified assembly, and long-term maintainability.
Precision Interconnect Solutions for Advanced Data Center Networks
FIT’s high-performance, solderless LGA-to-LGA sockets provide a simplified yet robust solution for integrating Broadcom’s switch ASICs into high-density systems. This innovation eliminates the need for traditional soldering, enabling faster and more flexible assembly while ensuring consistent yield and reliability. The solderless connection also ensures the stability and scalability of data center deployments as optical networks evolve.
Additionally, FIT’s PLS I/O cages and connector assemblies are engineered to withstand the thermal and mechanical challenges of high-speed optical environments. These components play a critical role in Broadcom’s vision for laser-disaggregated switch architectures, enabling significant power savings, bandwidth density, and performance scaling for hyperscale data centers.
Broadcom: A Trusted Partner in CPO Innovation
“We are proud to partner with Foxconn Interconnect Technology as a key enabler in the advancement of the TH5-Bailly CPO platform,” said Alvin Low, Director of Silicon Photonics Engineering, Optical Systems Division, Broadcom. “FIT’s expertise in precision interconnects and system integration is essential to the successful scale-out of our CPO technology in hyperscale environments. Their innovative components are central to the continued evolution of data center optical networking.”
Looking Ahead: Collaborating on Next-Generation CPO Platforms
FIT’s role extends beyond the current phase, as the company is actively involved in developing next-generation 200-Gbps per lane CPO platform components. By leveraging FIT’s deep expertise in socket design, optical I/O, and mechanical systems, the two companies are committed to addressing the rapidly growing demands of AI and high-performance computing (HPC) workloads.

"We are proud to partner with Foxconn Interconnect Technology as a key enabler in the advancement of the TH5-Bailly CPO platform," said Alvin Low, Director of Silicon Photonics Engineering, Optical Systems Division, Broadcom. "FIT's expertise in precision interconnects and system integration is essential to the successful scale-out of our CPO technology in hyperscale environments. Their innovative components are central to the continued evolution of data center optical networking."

Looking Ahead: Collaborating on Next-Generation CPO Platforms

FIT's role extends beyond the current phase, as the company is actively involved in developing next-generation 200-Gbps per lane CPO platform components. By leveraging FIT's deep expertise in socket design, optical I/O, and mechanical systems, the two companies are committed to addressing the rapidly growing demands of AI and high-performance computing (HPC) workloads.

"We are proud to partner with Foxconn Interconnect Technology as a key enabler in the advancement of the TH5-Bailly CPO platform," said Alvin Low, Director of Silicon Photonics Engineering, Optical Systems Division, Broadcom. "FIT's expertise in precision interconnects and system integration is essential to the successful scale-out of our CPO technology in hyperscale environments. Their innovative components are central to the continued evolution of data center optical networking."

"We are excited to our collaboration with Boardcom to shape the next-generation of 200G CPO solutions," said Alex An, Senior Director of Business Development, Foxconn Interconnect Technology. "Together, we are focused on enabling scalable AI infrastructure with cutting-edge interconnect solutions that combine reliability, power efficiency, and forward-thinking design."

Showcasing the Future of CPO Technology at Computex 2025
As part of their continued partnership, FIT will be showcasing illustrative samples of the LGA sockets and I/O modules at Computex 2025. These innovative solutions will be available for qualified platform developers looking to build the next-generation of AI-driven data center infrastructure.