Mezzanine 112G REC Side

Features

• Support 56 Gbps NRZ (112 Gbps PAM-4)
• Pitch: 4.0mm between differential pairs, 1.5mm between rows
• Mating Height: 5.0mm
• Pin Count: 600
• Voltage Rating (max.): 30 VDC
• Current (max. per contact): 1.0A
• Operating temperature: -40°C~105°C
• Impedance: 90 ohms

Mezzanine 112G Plug Side

PCIe5.0 M.2 Connector

Features

• The M.2 PCle 5.0 interface enables high-speed transmission of large files, significantly enhancing data read and write efficiency. A typical M.2 PCIe SSD boasts read and write speeds several times faster than a SATA SSD, thereby accelerating computer performance
• The M.2 PCIe interface is more compact than the SATA interface, eliminating the need for data and power cables which reduces wire clutter and saves internal space
• The M.2 PCle interface not only supports the SATA protocol, but also supports higher NVMe and AHCI protocols, providing faster speed

112G 600Pin BGA BTB (Mezzanine)

Features

• Support 1126 PAM-4
• 90 ohms impedance nominal
• Pitch: 4.0mm between differential pairs, 1.6mm between rows
• High-density connector pin field includes 145 differential pairs
• Stack heights: 5.0mm
• Contact bean structure of a mated combination.

QSFP-DD Connector & Cage

Features

• QSFP-DD 800 MSA Compliant
• Support 56 Gbps-NRZ & 112 Gbps-PAM4 signals
• 1x1-1×4 and 2x1 Configurations available
• Customized Heat Sink (~20W) and Light Pipe available
• Operating temperature: -40°C~85°C

QSFP112 Connector & Cage

Features

• QSFP112 0.6mm Pitch MSA Compliant
• Supports up to 112 Gbps PAM4 signals
• 1x1 and 2x1 Configurations available
• Customized Heat Sink (~20W) and Light Pipe available
• Operating temperature: -40°C~85°C

Fast Pass I/O (FPIO) High Speed Cabled Type IO

Features

• 32AWG drainless raw cable, 85 and 95

ohms impedance

• Robust latching for secure mating

SUPPORTED STANDARDS

• PCIe5
• PCIe6
• 56 Gbps-PAM4
• 112 Gbps-PAM4

APPLICATIONS

• High performance computing (HPC)
• High performance servers
• Data centers and enterprise networks
• Proprietary high-speed interconnect

OSFP Connector & Cage

Features

• OSFP MSA Compliant
• Supports up to 112 Gbps-PAM4 signals
• 2x1 Configuration support up to 53.125 GHz bandwidth (802.3dj 200G signaling)
• 1x1 and 2x1 Configurations available
• Operating temperature: -40°C~85°C

OSFP-XD

Features

• OSFP-XD MSA Compliant
• Supports up to 112 Gbps PAM4 signals
• 16 channels support 1.6T total bandwidth
• 1x1 Configuration in development (2024 03)
• Operating temperature: -40°C~85°C

DSFP Connector & Cage

Features

• DSFP MSA Compliant
• Supports up to 56 Gbps PAM4 signals
• 1x1, 1x2, 1x4, 1x8 Configurations available
• Customerized HeatSink and Light Pipe available
• Operating temperature: -40°C~85°C

SFP-DD Connector & Cage

Features

• SFP-DD MSA Compliant
• Supports up to 28 Gbps NRZ/56 Gbps PAM4 signals
• 1x1 Configuration available
• Operating temperature: -40°C~85°C

M.2, Gen3, 8.5mm

M.2, Gen4, 8.5mm

M.2, Gen5, 2.3mm MAX

M.2, Gen5, 3.2mm MAX

M.2, Gen5, 4.2mm MAX

M.2, Gen5, 6.7mm

M.2, Gen5, 8.5mm

Features

• 75pin, 0.5mm pitch
• LLCR Initial 56m max and delta no greater than 20m
• Current rating 0.5 or 14 per pin
• Insertion force 20 (2.04 kgf) max
• Durability 60 cycles
• Operating temperature-40°C-80°C
• Support 80T/S-320T/S

Intel Socket - BR

Features

• Pin count: 7529
• Pitch: 0.94mm × 0.81mm Hex
• Contact plating: 30u" Au plating
• Socket Outline dimension: 75.5mm×109.5mm
• Bolster Outline dimension: 140.5mm x100.7mm×24.2mm
• BP Outline dimension: 140.5mm×100.5mm×10.3mm
• Application: Networking, Server, Storage, Big Data, Cloud, Datacenter, Edge Computing, and HPC

AMD Socket – SP5

Features

• Pin count: 6096
• Pitch: 0.94mm × 0.81mm Hex
• Contact plating: 30u" Au plating
• Socket Outline dimension: 83mm ×77.9mm
• SRM Outline dimension: 119.3mm×92.9mm×10.18mm
• Socket Retention Mechanism (SRM)
• BP Outline dimension: 105.5mm×92.9mm×14.4mm
• Application: Networking, Server, Storage, Big Data, Cloud, Datacenter, Edge Computing, and HPC

Ampere Socket - 5964

Features

• Pin count: 5964 • Pitch: 1.00mm × 0.87mm Hex
• Contact plating: 30u” Au plating
• Socket Outline dimension: 93.0mm × 76.0mm × 9.5mm
• ILM Outline dimension: 133mm × 94mm × 14.3mm
• BP Outline dimension: 135.5mm × 96mm × 10.15mm
• Application: Networking, Server, Storage, Big Data, Cloud, Datacenter, Edge Computing, and HPC

Dell CAMM 1.0 Socket

Features

• Pin count: 616
• Pitch: 1.38mm×1.0mm
• Body Size: 73.9mm×14.65mm×2.87mm

Dell CAMM 2.0 Socket

Features

• Pin count: 356
• Pitch: 1.38mm×1.0mm
• Body Size: 77.8mm×17mm×2.85mm

Intel CAMM 2.0 Socket

Features

• Pin count: 644
• Pitch: 1.38mm×1.0mm
• Body Size: 77.8mm × 17mm×1mm

PCIe 12V-2x6 Power

Features

• Pin count: 2×6 + 4SBs
• Type: Vertical & Right Angle
• Pitch: Power pin 3.0mm × 3.0mm, Signal Pin 2.0mm
• Current: 9.2A
• Application: Networking, Server, Storage, Big Data, Cloud,
• Datacenter, Edge Computing, and HPC

SFF-TA-1002 Connector

Features

• Pin count: 56/84/140/168
• Type: Vertical & Right Angle
• Signal: PCIe Gen5
• Current: 1.1A per contact
• Follow SFF-TA-1002 spec
• Application: Networking, Server, Storage, Big Data, Cloud, Datacenter, Edge Computing, and HPC

SFF-TA-1020 Connector

Features

• Pin count: 56/84/140/168
• Type: Vertical & Right Angle
• Signal: PCIe Gen5
• Current: 1.1A per contact
• Follow SFF-TA-1020spec
• Application: Networking, Server, Storage, Big Data, Cloud, Datacenter, Edge Computing, and HPC

MXIO cable (SFF-TA-1033)

Features

MCIO cable (SFF-TA-1016)

Features

• 1.57mm PCB card thickness compatible with PCle rise card
• Small size design with pitch 0.6mm connector
• Multiple pin configurations possible: 4X (38-pin), 8X (74-pin), and 16X (124-pin)
• Supports signaling rates up to 32GT/s and 56GT/s NRZ, and 112GT/s PAM-4 in the future
• Straight, Right Angle, or optional Customized Cable Plug types available
• 30-32AWG available in discrete and ribbon cable
• Supports 85ohm impedance applications
• RoHS compliant

MCIO Connector

Features

• Pin count: 38/74/124/148
• Type: Vertical & Right Angle
• Signal: PCIe Gen5/Gen6
• Current: 1.1A per contact max
• Follow SFF-TA-1016 spec
• Application: Networking, Server, Storage, Big Data, Cloud, Datacenter, Edge Computing, and HPC

MXIO Connector

Features

• Configurations: X8 + Power, X16 +Power, Power only
• Type: Vertical
• Signal PCIe Gen5/Gen6
• Supports 21A/34A/55A Power
• Follow SFF-TA-1033 spec
• Application: Networking, Server, Storage, Big Data, Cloud, Datacenter, Edge Computing, and HPC

Swift Connector

Features

• Pin count: 74
• Type: Vertical
• Signal: PCIe Gen5
• Current: 0.5A per contact
• Application: Networking, Server, Storage, Big Data, Cloud, Datacenter. Edge Computing, and HPC

Nearstack Connector

Features

• Pin count: 74/144
• Type: Vertical
• Signal: PCIe Gen5
• Current: 0.65A per "S" contact max, 0.30A per "SB" contact max
• Follow SFF-TA-1026 spec
• Application: Networking, Server, Storage, Big Data, Cloud, Datacenter, Edge Computing, and HPC

EDSFF Connector

Features

• Pin count: 56/84/224
• Type: Pressfit & Hybrid
• Signal: PCIe Gen5
• Current: 1.1A per contact
• Pin define: follow SFF-TA-1009
• Application: Networking, Server, Storage, Big Data, Cloud, Datacenter, Edge Computing, and HPC

PCIe SAS Connector

Features

• Pin count: 68
• Type: Vertical & Right Angle
• Signal: PCIe Gen5
• Current: 1.5A per power contact
• Follow SFF-TA-1002 spec
• Application: Networking, Server, Storage. Big Data, Cloud, Datacenter, Edge Computing, and HPC

M-PIC Connector

Features

• Pin count: 2×6+12SBs, 2x3+6SBs
• Type: Vertical & Right Angle
• Pitch: Power pin 3.0mm x 3.0mm, Signal Pin 1.5mm
• Current: 12A for 2x6 + 12SBs, 13.5A for 2×3+6SBs
• Application: Networking, Server, Storage, Big Data, Cloud, Datacenter. Edge Computing, and HPC

FoxRA (FAKRA)

Features

• 1 Port High Profile
• PCB Connector
• Interface: FAKRA

FoxRA (FAKRA)

Features

• 1 Port
• PCB Connector
• Interface: FAKRA

FoxRA (FAKRA)

Features

• 1 Port
• Female Cable Connector
• Interface: FAKRA

FoxRA (FAKRA)

Features

• 1 Port Low Profile
• PCB Connector
• Interface: FAKRA

FoxRA (FAKRA)

Features

• 1 Port
• PCB Connector
• Vertical
• Interface: FAKRA

Fox Trot (Mini FAKRA)

Features

• 4 Ports (Tail length 2.1mm)
• Right Angle PCB Connector
• Interface: HFM

FoxTrot (Mini FAKRA)

Features

• 4 Ports (Tail length 2.4mm)
• Right Angle PCB Connector
• Interface: HFM

FoxTrot (Mini FAKRA)

Features

• 4 Parts
• Right Angle PCB Latch Down Connector
• Interface: HFM

FoxTrot (Mini FAKRA)

Features

• 2 Ports
• Vertical PCB Connector
• Interface: HFM

FoxTrot (Mini FAKRA)

Features

• 2 Ports
• Female Cable Connector
• Interface: HFM

FoxTrot (Mini FAKRA)

Features

• 4 Ports
• Female Cable Connector
• Interface: HFM

FoxTrot (Mini FAKRA)

Features

• 4 Ports
• Waterproof Right Angle PCB Connector
• Interface: HFM

Fox Trot (Mini FAKRA)

Features

• 4 Ports
• Waterproof Female Cable Connector
• Interface: HFM

Fox X (Mini FAKRA)

Features

• 4 Ports (Plating Au)
• Right Angle PCB Connector
• Interface: Mate-AX

Fox X (Mini FAKRA)

Features

• 4 Ports (Plating Ag)
• Right Angle PCB Connector
• Interface: RMC

Fox X (Mini FAKRA)

Features

• 1 Port (Plating Ag)
• Right Angle PCB Connector
• Interface: RMC

FoxRA (FAKRA)

Features

• Camera Module Connectors
• Floating Mini FAKRA + PCB Adapter
• Interface: Mate-AX

FoxRA (FAKRA)

Features

• 1 Port High Profile
• PCB Connector
• Interface: FAKRA

FoxRA (FAKRA)

Features

• 1 Port
• Waterproof Female Cable Connector
• Interface: FAKRA

FoxRA (FAKRA)

Features

• 1 Port
• Waterproof Male Cable Connector
• Interface: FAKRA

FoxTrot (Mini FAKRA)

Features

• 1 Port
• Waterproof Female Cable Connector
• Interface: HFM

FoxNet II

Features

• 1 Port
• Right Angle PCB Connector
• Interface: H-MTD

FoxNet II

Features

• 1 Port
• Right Angle PCB Connector Latch Down
• Interface: H-MTD

FoxNet II

Features

• 1 Port
• Female Cable Connector
• Interface: H-MTD

FoxNet II

Features

• 1 Port
• Inline Male Cable Connector
• Interface: H-MTD

FoxNet II

Features

• 2 Ports
• Right Angle PCB Connector
• Interface: H-MTD

FoxNet II

Features

• 2 Ports
• Female Cable Connector
• Interface: H-MTD

FoxNet II

Features

• 4 Ports
• Right Angle PCB Connector
• Interface: H-MTO

FoxNet II

Features

• 4 Ports
• Female Cable Connector
• Interface: H-MTD

FoxNet II

Features

• 4 Ports
• Waterproof Right Angle PCB Connector
• Interface: H-MTO

FoxNet II

Features

• 4 Ports
• Waterproof Straight Cable Connector
• Interface: H-MTD

FoxNet II

Features

• 1 Port
• Vertical PCB Connector
• Interface: H-MTO

FoxNet II

Features

• 2 Ports
• Vertical PCB Connector
• Interface: H-MTD

FoxNet II

Features

• 4 Ports
• Vertical PCB Connector
• Interface: H-MTO

400G QSFP-DD DAC

Features

• Cable length up to 2.5m
• Data rate up to 56Gbps PAM4 per channel
• Compliant with QSFP-DD MSA form factor
• Compliant with IEEE 802.3cd and CMIS
• Differential Impedance: 1000 ± 100
• Operating case temperature 0°C-70°C
• Cable with PVC or LSZH jacket

400G QSFP-DD DAC 1 × 2

Features

• Cable length up to 2.5m
• Data rate up to 56Gbps PAM4 per channel
• OSFP-DD module is compliant with QSFP-DD MSA and CMIS
• QSFP56 module is compliant with SFF-8636 MSA
• Compliant with IEEE 802.3cd
• Differential Impedance: 1000 ± 100
• Operating case temperature 0°C~70°C
• Cable with PVC or LSZH jacket

400G QSFP-DD DAC 1 × 4

Features

• Cable length up to 2.5m
• Data rate up to 56Gbps PAM4 per channel, 2 electrical lanes of 56Gbps PAM4 signal on each QSFP56 end
• QSFP-DD module is compliant with QSFP-DD MSA and CMIS
• QSFP56 module is compliant with SFF-8636 MSA
• Differential Impedance: 1000 ± 100
• Operating case temperature 0°C-70°C
• Cable with PVC or LSZH jacket

400G QSFP-DD DAC 1 × 8

Features

• Cable length up to 2.5m
• Data rate up to 56Gbps PAM4 per channel
• Compliant with QSFP-DD/ SFP56 MSA form factor
• Compliant with IEEE 802.3cd and CMIS
• Differential Impedance: 1000 ± 100
• Operating case temperature 0°C~70°C
• Cable with PVC or LSZH jacket

800G QSFP-DD AEC

Features

• Cable length up to 7m
• Data rate up to 112Gbps PAM4 per channel
• Compliant with OSFP-DD MSA, IEEE 802.3ck, and CMIS
• Power consumption less than 5W (CDR)/12W (DSP) per cable end
• Differential Impedance: 1000 ± 100
• Operating case temperature 0°C-70°C
• Cable with PVC or LSZH jacket, or braided sleeve

400G QSFP-DD AEC

Features

Cable length up to 7m (BER<10-8 pre-FEC)

• Data rate up to 56Gbps PAM4 per channel
• Compliant with QSFP-DD MSA form factor
• Compliant with IEEE 802.3cd and CMIS
• Power consumption about 4.5W per cable end
• Differential Impedance: 1000±100
• Operating case temperature 0°C~70°C
• Cable with PVC or LSZH jacket. or braided sleeve

400G QSFP112 DAC

Features

• Cable length up to 2m
• Data rate up to 112Gbps PAM4 per channel
• Compliant with QSFP112 MSA form factor
• Compliant with IEEE 802.3ck and CMIS
• Differential Impedance: 1000 ± 100
• Operating case temperature 0°C~70°C
• Cable with PVC or LSZH jacket

800G QSFP-DD DAC

Features

• Cable length up to 2m
• Data rate up to 112Gbps PAM4 per channel
• Compliant with QSFP-DD MSA form factor
• Compliant with IEEE 802.3ck and CMIS
• Differential Impedance: 1000 ± 100
• Operating case temperature 0°C~70°C
• Cable with PVC or LSZH jacket, or braided sleeve

800G QSFP-DD ACC

Features

• Cable length up to 4m
• Data rate up to 112Gbps PAM4 per channel
• Compliant with QSFP-DD MSA form factor
• Compliant with IEEE 802.3ck and CMIS
• Power consumption less than 1.3W per cable end
• Differential Impedance: 1000 ± 100
• Operating case temperature 0°C~70°C
• Cable with PVC or LSZH jacket, or braided sleeve

800G OSFP DAC

Features

• Cable length up to 2m
• Data rate up to 112Gbps PAM4 per channel
• Compliant with OSFP MSA form factor
• Compliant with IEEE 802.3ck and CMIS
• Differential Impedance: 1000 ± 100
• Operating case temperature 0°C~70°C
• Cable with PVC or LSZH jacket, or braided sleeve

800G OSFP AEC

Features

• Cable length up to 7m
• Data rate up to 112Gbps PAM4 per channel
• Compliant with OSFP MSA form factor
• Compliant with IEEE 802.3ck and CMIS
• Power consumption less than 5W (CDR)/ 12W (DSP) per cable end
• Differential Impedance: 1000 ± 100
• Operating case temperature 0°C~70°C
• Cable with PVC or LSZH jacket, or braided sleeve

400G QSFP-DD SR8

Features

• Data rate up to 53.125Gbps (26.5625GBd PAM4) per channel
• Compliant with QSFP-DD MSA form factor
• Compliant with IEEE 802.3cm, IEEE 802.3cd
• Reach up to 100m over OM5 MMF with FEC
• MP024/PC or MP016/APC receptacle
• 8-channels 850nm VCSEL array and PIN photo-detector array
• Operating case temperature 0°C-70°C
• 8W maximum power dissipation per 400G QSFP-DD SR8 module

400G QSFP-DD AOC

Features

• Data rate up to 53.125Gbps (26.5625GBd PAM4) per channel
• Compliant with OSFP-DD MSA form factor
• Compliant with IEEE 802.3cm
• Customizable length up to 30m (0M4)
• 8-channels 850nm VCSEL array and PIN photo-detector array
• Operating case temperature 0°C~70°C
• 6.5W maximum power dissipation per 400G QSFP-DD one side AOC module

400G QSFP-DD AOC 1 × 2

Features

• Data rate up to 53.125Gbps (26.5625GBd PAM4) per channel
• Compliant with QSFP-DD/QSFP56 MSA form factor
• Compliant with IEEE 802.3cm, IEEE 802.3cd
• Customizable length up to 30m (0M4)
• 8-channels 850nm VCSEL array and PIN photo-detector array
• Operating case temperature 0°C-70°C
• 6.5W maximum power dissipation per 400G QSFP-DD AOC module
• 5W maximum power dissipation per 200G QSFP56 SR4 module

400G QSFP-DD AOC 1 × 4

Features

• Customizable length up to 10m
• Data rate up to 53.125Gbps (26.5625GBd PAM4) per channel
• Compliant with QSFP-DD/0SFP56 MSA form factor
• Compliant with IEEE 802.3cm, IEEE 802.3cd
• 8-channels 850nm VCSEL array and PIN photo-detector array
• Operating case temperature 0°C~70°C
• 6.5W maximum power dissipation per 400G QSFP-DD AOC module
• 4.5W maximum power dissipation per 100G QSFP56 SR2 module

800G QSFP-DD SR8

Features

• 8x106.25Gb/s electrical interface (800GAUI-8)
• Single +3.3V power supply
• DDM function implemented
• Supports 800GAUI-8 electrical interface
• Integrated 850nm VCSEL array and PD array
• Hot-pluggable QSFP-DD form factor
• Compliant with CMIS 5.0
• Maximum power consumption 14W
• Up to 106 Gbps data rate per channel by PAM4 modulation
• Compliant to OSFP-DD/QSFP-DD800/QSFP112 HW Rev 6.2
• Operating case temperature 0°C-70°C
• Compliant with ROHS2.0

800G QSFP-DD AOC

Features

• Customizable length up to 30m
• 8x106.25Gb/s electrical interface (800GAUI-8)
• Single +3.3V power supply
• DDM function implemented
• Supports 800GAUI-8 electrical interface
• Integrated 850nm VCSEL array and PD array
• Hot-pluggable QSFP-DD form factor
• Compliant with CMIS 5.0
• Maximum power consumption 14W
• Up to 106 Gbps data rate per channel by PAM4 modulation
• Compliant to QSFP-DD/QSFP-DD800/QSFP112 HW Rev 6.2
• Operating case temperature 0°C~70°C
• Compliant with ROHS2.0

800G OSFP SR8

Features

• 53.125 GBd PAM4 x 8 channel 800G-SR8 Optical interface
• 53.125 GBd PAM4 x 8 channel 800GAUI-8 C2M Electrical interface
• Power consumption <12W
• Compliant with OSFP MSA, CMIS and IEEE 802.3ck
• Built-in DSP
• 850nm VCSEL and PIN receiver
• OSFP MSA package with 2 x MPO-12 APC
• Up to 100m transmission distance on OM4 MMF
• Operating case temperature 0°C~70°C
• Very low EMI and excellent ESD protection

800G OSFP AOC

Features

• Customizable length up to 30m
• 53.125 GBd PAM4 x 8 channel Optical interface
• 53.125 GBd PAM4 x 8 channel 800GAUI-8 C2M Electrical interface
• Power consumption <12W
• Compliant with OSFP MSA, CMIS and IEEE 802.3ck
• 850nm VCSEL and PIN receiver
• OSFP MSA package
• Maximum link length of 30m on OM4 MMF
• Operating case temperature 0°C-70°C