FIT deploys three key industries and three core technologies, of which the three key industries are EV Mobility, 5G AIOT, and Audio. The innovative technologies, products and services of these three key industries; will bring a remarkable and satisfying user experience. The three core technologies are Copper to Optics, Wire to Wireless, and Component to Module. These three key technology areas can provide services for various world-class brands and private label products across B2C and B2B; we are the world's leading technology and pioneers of technology trends.
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EV Mobility
EV mobility will be the major catalyst as growing EV models are launched in the upcoming 2 to 3 years by legacy ICE auto manufacturers and EV start-ups. Leveraging our core technologies and vertical integration in interconnectivity solutions, FIT will target the triangular sweet spots for EV connectivity, with solutions for power connection, data & command connection, as well as human-to-machine connectivity. In 2021, we laid the foundation by pooling resources within the MIH alliance to accelerate our transition to capture the rapidly expanding EV market.
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5G AIoT
We have acquired a leading position in the IaaS industry and developed core technologies over the years. Capitalizing on these advantages, we shall build market leadership in high-speed interconnectivity solutions for IoT and the 5G/6G infrastructure, which supports higher cloud transmission performance and line extension for audio.
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Audio
We are developing high-quality acoustic modules and establishing our presence for the audio supply chain. Leveraging our R&D and vertically integrated manufacturing capability, FIT can provide a full spectrum of partnering solutions – from ODM, OEM to OBM manufacturing for our brand customers.
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3 key industries
Combining FIT‘s rich industrial experience and supply chain advantages, we will continue to improve the development of new products in the 3 key industries and drive profit growth in the future.
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Copper to Optics
The upgrading of data communication technology has spawned a variety of new business application requirements, resulting in an explosive increase in traffic demand. The widespread adoption of fiber optic connectors in the communication infrastructure end market is due to its advantages of low signal attenuation, high speed and noise immunity. Compared to copper connectors, fiber optic connectors can provide more bandwidth and better signal over longer distances as well as reliable data with less interference.
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Wire to Wireless
FIT has been working in the field of networking for over two decades, we keep up with the industry trend of wireless applications. FIT focus on developing technologies of power (wireless charging products) and signal (millimeter wave applications) related application which takes into account both safety and convenience.
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Component to Module
As a leading manufacturer of components, with a certain level of assembly technology, FIT provides services for various world-class brands and private label products across B2C and B2B; we are the world's leading technology and pioneers of technology trends.
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3 key technology areas
In addition to leveraging our own R&D capabilities to deploy the three major technologies, FIT has continuously improved its technological content through alliances, joint ventures and acquisitions, while expanding its technology application fields.
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Manufacturing of high precision components
The manufacturing of connector is characterized by a high degree of precision, and the trend of miniaturization of electronic equipment has increased the demand for professional design of micro connectors, which making FIT's leading position in the ICT industry.
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Connectivity Solutions
Connector products play key role in the performance of electronic products, and are required to have high quality of transmission capabilities involving telecommunications, data, power, and acoustics.
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Rapid Ramp-up Large scale of Manufacturing
In the past, by optimizing resource allocation, FIT was able to rapidly ramp up Large scale in a short period of time, and be able to produce technically complex products on a large scale. Therefore, FIT has accumulated quite a complete experience, and has passed the customer's strict selection of suppliers' audit procedures, making us the favorite of many well-known customers. Key suppliers and strategic relationships with us all demonstrate our strong production capacity and quality.
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Three core technologies
With the core competencies of design and precise manufacturing, quick-to-ramp, high-volume and flexible production capabilities, collaborative relationships with industry-leading customers that integrate our solutions into their design, development and production processes, hon hai group ecosystem provides a unique competitive advantage, experienced and committed management team.
Foxconn Interconnect Technology Showcases PCIe6 and PCIe7 with Alphawave Semi at DesignCon 2025.
Santa Clara, Calif., January 28, 2025 -- Foxconn Interconnect Technology (6088.HK) (“FIT”), a leading connective solution provider creating powerful connections for a better world, today announced the demonstration of it’s PCI Express® (PCIe®) 6.0 signal transmission through their CDFP SMT connector with a Passive DAC cable and also PCIe 7.0®-capable transmission through their OSFP-XD SMT connector with a Passive DAC cable at the DesignCon 2025 exhibition in Santa Clara, California from January 28th to January 30th, 2025.
2025-01-28
Foxconn Interconnect Technology Showcases PCIe6 and PCIe7 with Alphawave Semi at DesignCon 2025. Santa Clara, Calif., January 28, 2025 -- Foxconn Interconnect Technology (6088.HK) (“FIT”), a leading connective solution provider creating powerful connections for a better world, today announced the demonstration of it’s PCI Express® (PCIe®) 6.0 signal transmission through their CDFP SMT connector with a Passive DAC cable and also PCIe 7.0®-capable transmission through their OSFP-XD SMT connector with a Passive DAC cable at the DesignCon 2025 exhibition in Santa Clara, California from January 28th to January 30th, 2025. FIT’s own CDFP SMT connector and Passive DAC cable will appear together with Alphawave Semi’s 64 GT/ PCIe 6.0® Subsystem for Disaggregated Networks. Alphawave Semi’s PipeCORE? is their PCIe 6.0 Subsystem IP Supporting CDFP PCIe Direct Attach Cabling which will enable the industry to make the move to disaggregated server resources within a data center rack. Alphawave Semi’s complete PCIe 6.0® subsystem solution is supporting FIT’s CDFP PCIe Direct Attach Cables and delivering a max reach of 4 meters. This advanced integration leverages Alphawave Semi's sophisticated controller IP and top-tier PAM4 SerDes PHY, delivering unmatched performance at the lowest power and lowest latency channel solution. Witness how these combined technologies redefine connectivity and throughput in cutting-edge data centers, setting new standards for the PCIe 6.0® ecosystem and PCI-SIG’s CopprLink. In addition, FIT’s own OSFP-XD SMT connector and Passive DAC cable will appear together with Alphawave Semi’s 128 GT/ PCIe 7.0® Performance System for Scale Up Networks. Alphawave Semi’s PipeCORE? is their PCIe 7.0® IP Supporting OSFP-XD PCIe Direct Attach Cabling which will enable the industry to make the move to high-speed, high bandwidth-density scale up resources within a data center rack, Alphawave Semi’s PCIe 7.0® solution leveraging our industry pioneering 112G DSP-based SerDes, are already here supporting FIT’s OSFP-XD PCIe Direct Attach Cables and delivering a max reach of 2 meters, ideal for scale-up networks. This advanced integration leverages Alphawave Semi's top-tier PAM4 SerDes PHY, delivering unmatched performance at the lowest power and lowest latency channel solution. Highly correlated models with in-lab measurements enable fast to market, complete solutions at 128 Gbps. Applications: ‧ Telecom/High-Performance Computing Systems ‧ Data Center Switches, Routers and Servers Configurations to accommodate 112 Gbps and PCIe 6.0® and 7.0®
Protocols Supported: ‧ IEEE 802.3ck ‧ IEEE 802.3dj (in progress) ‧ OSFP-XD MSA specification ‧ PCIe Gen6 and Gen7 ecosystem ‧ PCI-SIG CopprLink specification ‧ CXL Standard
About FIT Hon Teng Foxconn Interconnect Technology (FIT) is a leading global solutions developer and manufacturer, cultivating connectivity for a better world. With unsurpassed capabilities in development, research, manufacturing engineering and design, production, supply chain, and go-to-market planning for world class brands and private label products spanning B2C and B2B categories, FIT is at the forefront of worldwide technological trends delivering compelling user experiences at scale. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components. For more information, visit FIT’s website: https://www.fit-foxconn.com.
News Contact: EMAIL: fit-ir@fit-foxconn.com Product Service Contact: USA region EMAIL: sales-usa@fit-foxconn.com
FIT Voltaira Group Completes Acquisition of Auto-Kabel Group
FIT Voltaira Group (Voltaira), a leading system supplier of sensor, connectivity, and electrification solutions, specializing in wire harness technologies, today announced the completion of its acquisition of Auto-Kabel Group as of November 29, 2024. Auto-Kabel, based in Hausen im Wiesental, Germany (Baden-Wurttemberg), is a pioneer in e-mobility and a technology leader in automotive power distribution and management.
2024-12-02
Reutlingen, Germany-FIT Voltaira Group (Voltaira), a leading system supplier of sensor, connectivity, and electrification solutions, specializing in wire harness technologies, today announced the completion of its acquisition of Auto-Kabel Group as of November 29, 2024. Auto-Kabel, based in Hausen im Wiesental, Germany (Baden-Wurttemberg), is a pioneer in e-mobility and a technology leader in automotive power distribution and management. The acquisition, previously announced on July 11, 2024, significantly strengthens Voltaira’s product portfolio in intelligent energy distribution systems, including innovative battery harnesses, busbars, and high-voltage vehicle electrical systems. The combined entity, Voltaira, will now boast a global presence, with more than 50 locations across Europe, Asia, North America and Africa, and over 11,500 people worldwide. “We are delighted to welcome the Auto-Kabel Group to the Voltaira family,” said Chris Lu, Global COO of FIT Group and Managing Director of Voltaira. “This strategic acquisition solidifies our commitment to electrified vehicle technology and reinforces our dedication to pioneering solutions. Our customer knowledge and expertise with both OEMs and mobility suppliers will empower us to uniquely address the evolving needs of both audiences, positioning us at the forefront of the industry.” Going forward, the Auto-Kabel brand will operate under the name Voltaira AutoKabel , reflecting its integration into the Voltaira Group while respecting its historical significance in the mobility market. This rebranding will leverage the strength of the Voltaira brand while honoring Auto-Kabel’s legacy and industry expertise. “We are incredibly excited to join Voltaira ,” said Jens Schumacher, CSO of Auto-Kabel Group. “This partnership is built on a shared commitment to quality, innovation, and deep industry expertise. We see a promising future ahead, and the synergies between our businesses will enhance our product offerings and drive sustainable growth.” The acquisition was made through a wholly owned German SPV of Foxconn Interconnect Technology GmbH, the holding company of FIT Voltaira Group GmbH. Voltaira, owned by Foxconn Interconnect Technologies Limited (“FIT”), benefits from a solid financial foundation that supports growth in the rapidly evolving automotive market.
About Voltaira Group At Voltaira Group, we drive the future of sustainable mobility with creative solutions and cutting-edge technology. As an established system supplier in the mobility industry, we are proud of our long-standing partnerships with major Tier 1 automotive suppliers and OEMs. Our core competencies include the design, development and manufacture of sensor, connectivity, and electrification solutions for the automotive and micro-mobility sectors. Recognized for our commitment to quality and German engineering excellence, the Voltaira brand is trusted worldwide. Through our strategic partnerships, we offer endless possibilities in mobility, from charging solutions to 5G AIoT. The Voltaira Group operates globally with more than 50 sites in Europe, Asia, North America and Africa, employing more than 11,500 people. About Auto-Kabel Group Auto-Kabel Group is an international leader in electromobility, with 90 years of innovation and top-tier manufacturing quality. Auto-Kabel Group supplies electrical components for automotive systems and power distribution, focusing on e-mobility solutions. As a system supplier, Auto-Kabel Group offers a wide range of products, including charging sockets, drive cables, and battery connectors, to customers worldwide.
About Foxconn Interconnect Technology (FIT Hon Teng) Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Asia. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, Mobility, and Audio, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com
Media Inquiries Voltaira Group, Corporate Email: Press.Services@voltaira-group.com Follow us on social media: LinkedIn
Ministry of Energy Announces Joint Venture Between Saleh Suleiman Alrajhi & Sons and Foxconn Interconnect Technology to Advance Vision 2030 with Future Plans for Locally-made EV Chargers.
Riyadh, Saudi Arabia –Ministry of Energy has announced the formation of a groundbreaking joint venture between Saleh Suleiman Alrajhi & Sons and Foxconn Interconnect Technology (FIT), a highly esteemed global manufacturer to support the Kingdom's Vision 2030. The partnership aims to produce Saudi-made electric vehicle (EV) charging stations, strengthening Saudi Arabia’s leadership in renewable energy and technological innovation.
2024-10-23
From left to right, Suleiman AlRajhi, H.E. Bandar Alkhorayef (Minister of Industries and Mineral Resources),Sidney Lu(FIT CEO), H.E. Prince Abdulaziz bin Salman Al-Saud (Minister of Energy), H.H. Prince Fahad al Saud, H.E. DR. Hamad Al AlSheik(Minister of State), Louie Yeh
Riyadh, Saudi Arabia –Ministry of Energy has announced the formation of a groundbreaking joint venture between Saleh Suleiman Alrajhi & Sons and Foxconn Interconnect Technology (FIT), a highly esteemed global manufacturer to support the Kingdom's Vision 2030. The partnership aims to produce Saudi-made electric vehicle (EV) charging stations, strengthening Saudi Arabia’s leadership in renewable energy and technological innovation.
This partnership is endorsed by Prince Abdulaziz bin Salman Al-Saud, Minister of Energy; Mr. Bandar Alkhorayef, Minister of Industry and Mineral Resources; and Mr. Hamad Al Sheikh, a government minister, reflecting strong support from the Saudi authorities
On behalf of Saleh Suleiman Alrajhi & Sons, Next Charger, the company’s subsidiary, has accumulated highly respected experience in the local charging pile industry. The collaboration with major European brands and local distributors has contributed extensive practices which will be leveraged in the joint venture, providing valuable insights and proven strategies for success.
The signing ceremony is inaugurated by H.H. Prince Fahad bin Nawaf Al Saud who emphasized his shared vision under the leadership of HRH the crown prince Mohammad Bin Salman. “We are committed to creating a sustainable and diverse future for the Kingdom,” Prince Fahad declared. By sharing his perspective as a forward-thinking entrepreneur and prestigious market leader, H.H.Prince Fahad envisions the joint venture as pivotal in driving the growth of electric mobility across Saudi Arabia.
FIT, a subsidiary of Foxconn Technology Group, has comprehensive charging solutions evidencing its excellent design capability for power modules and top-notch manufacturing capability. “By reducing the Kingdom’s reliance on imports and fostering domestic expertise, we can boost job creation and enhance the country’s technological self-sufficiency. Partnering with FIT is a strategic step toward local manufacturing,” Said Suleiman AlRajhi, Chairman of Saleh Suleiman Alrajhi & Sons.
FIT has already achieved significant milestones, including the certification of its AC charger by the Saudi Standards, Metrology and Quality Organization (SASO). Their award-winning design team, recipient of the 2024 IF Design Award and Red Dot Award, will bring unparalleled customization options to the joint venture, tailoring charger designs to meet market preferences. Louie Yeh, Head of FIT’s charging pile business, commented: “Our joint venture will prioritize the development of high-quality charging stations designed for optimal performance in Saudi Arabia’s unique environmental conditions. Given the intense sunlight, our products underwent UV testing to ensure durability.”
The signing ceremony also underscored the partnership’s broader impact, extending beyond technological innovation to focus on talent development for the Kingdom’s future. Mr. Andreas Cangellaris, Founding President of NEOM University, was in attendance, reuniting with Sidney Lu, Chairman & CEO of FIT. Both men share a strong connection to the University of Illinois Urbana-Champaign (UIUC), where Lu’s contributions led to the renaming of the Mechanical Engineering Building in his honor, and where Mr. Cangellaris previously served as Provost before joining NEOM.
This joint venture not only represents a critical step forward for the Kingdom’s renewable energy sector but also underscores a commitment to shaping the next generation of skilled professionals. "Through this partnership, we aim to drive innovation in EV charging solutions while cultivating local talent, aligning with Vision 2030’s goals of creating a sustainable, diversified economy," the companies jointly stated.
About Saleh Suleiman Alrajhi & Sons Saleh Suleiman Alrajhi & Sons, established in 2011, is a prominent and well-established family business in Saudi Arabia. Their business dates back to 1957 when the world’s first Islamic bank was established. Over the years, the family has played a significant role in the country’s economic reforms and initiatives. With a diverse portfolio spanning healthcare, construction, steel and manufacturing, and technology, Alrajhi is driving growth through strategic partnerships with global industry leaders, embracing innovative practices, and incorporating a range of perspectives to boost its competitiveness on the international stage. The company also invests in promising future technologies that align with Vision 2030.
About Foxconn Interconnect Technology (FIT Hon Teng) Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com
Voltaira to Showcase Comprehensive Mobility Solutions and Product Lifecycle Expertise at IZB 2024
Voltaira Group, a leading provider of sensor, connectivity, and electrification solutions specializing in wire harness technologies, is proud to announce its participation at the International Suppliers Fair (IZB) 2024, taking place in Wolfsburg, Germany. At the event, Voltaira will unveil its comprehensive solutions portfolio and highlight its product lifecycle management expertise, reinforcing its pivotal role in shaping the future of sustainable mobility.
2024-10-21
Voltaira to Showcase Comprehensive Mobility Solutions and Product Lifecycle Expertise at IZB 2024
October 21, 2024 | Wolfsburg, Germany
Voltaira Group, a leading provider of sensor, connectivity, and electrification solutions specializing in wire harness technologies, is proud to announce its participation at the International Suppliers Fair (IZB) 2024, taking place in Wolfsburg, Germany. At the event, Voltaira will unveil its comprehensive solutions portfolio and highlight its product lifecycle management expertise, reinforcing its pivotal role in shaping the future of sustainable mobility.
Backed by a strong foundation in automotive technologies and leveraging the advanced electronics capabilities of its parent company, Foxconn Interconnect Technologies (FIT), Voltaira is at the forefront of transforming the automotive and micro-mobility sectors. The company delivers cutting-edge connectivity system solutions for the next generation of vehicles.
Introducing its end-to-end solution portfolio
At IZB 2024, Voltaira will present its complete range of offerings, underscoring its leadership in sensor technology, connectivity, and electrification. As part of the FIT Group, Voltaira’s portfolio spans the entire product lifecycle — from concept design and co-development to manufacturing and end-of-life services — empowering mobility original equipment manufacturers (OEMs) and suppliers to innovate efficiently and with agility.
“We are excited to demonstrate how our European heritage and automotive expertise, combined with the agility and innovation of the Asian players, allow us to bring a fresh perspective to the industry,” said Ulrich Eichler, CEO of Voltaira Group. “From advanced charging solutions to integrated connectivity systems, our products address today’s key challenges while laying the foundation for future innovations.”
Embracing creative solutions and cutting-edge technology
As the automotive industry continues its digital transformation, Voltaira is capitalizing on key megatrends, including electrification, connectivity, micromobility, and autonomous driving. Mobility players today face challenges like need for implementing parallel technologies, extreme cost-effectiveness, space constraints, and the integration of disparate supplier products. Voltaira’s strength lies in turning these challenges into opportunities through its creativity and commitment to innovative connectivity solutions, global coverage and in-houe value chain.
A strategic partnership with Foxconn Interconnect Technologies (FIT)
As a subsidiary of Foxconn Interconnect Technologies (FIT), Voltaira blends its automotive engineering excellence with FIT’s leadership in electronics and precision manufacturing. This synergy offers the automotive sector an unparalleled value proposition, combining the best of both industries.
“With FIT’s expertise in smart devices, 5GAIoT, and audio, Voltaira is positioned at the forefront of the convergence of automotive and electronics, Together, we are shaping the future of mobility with solutions that are smarter, safer, and more sustainable.”
Shaping the future of sustainable mobility
Voltaira’s vision extends beyond connectivity and electrification. The company is actively developing forward-thinking solutions for the broader mobility ecosystem, including intelligent charging infrastructures and innovative electrification systems.
Visit Voltaira at IZB 2024! Voltaira invites all attendees to visit its booth at IZB 2024 to explore its solutions portfolio, experience live demonstrations, and discuss collaboration opportunities.
Event Details:
Date: October 22-24, 2024 Location: IZB, Wolfsburg, Germany Booth: 3105, Hall 3 For more information about Voltaira’s participation at IZB 2024 or to schedule a meeting, please visit www.voltaira-group.com or contact Bernadett Torok, Global Director of Marketing and Communications (press.services@voltaira-group.com).
FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
Hong Kong – October 16, 2024 – FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers.
2024-10-16
Hong Kong – October 16, 2024 – FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers. At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT’s AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads. Key product highlights include: 224G+ sockets for XPU/GPU connectivity Co-packaged copper and optical architectures Power cables for ORV3 Active Optical Cables (AOC) OSFP1600 and QSFP-DD port configurations These solutions underscore FIT’s commitment to driving innovation in the AI data center space, building on Foxconn’s extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers. In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms.” The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers. By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions.
FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
Hong Kong – October 16, 2024 – FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers.
2024-10-16
Hong Kong – October 16, 2024 – FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers. At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT’s AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads. Key product highlights include: 224G+ sockets for XPU/GPU connectivity Co-packaged copper and optical architectures Power cables for ORV3 Active Optical Cables (AOC) OSFP1600 and QSFP-DD port configurations These solutions underscore FIT’s commitment to driving innovation in the AI data center space, building on Foxconn’s extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers. In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms.” The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers. By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions.