FIT deploys three key industries and three core technologies, of which the three key industries are EV Mobility, 5G AIOT, and Audio. The innovative technologies, products and services of these three key industries; will bring a remarkable and satisfying user experience. The three core technologies are Copper to Optics, Wire to Wireless, and Component to Module. These three key technology areas can provide services for various world-class brands and private label products across B2C and B2B; we are the world's leading technology and pioneers of technology trends.
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EV Mobility
EV mobility will be the major catalyst as growing EV models are launched in the upcoming 2 to 3 years by legacy ICE auto manufacturers and EV start-ups. Leveraging our core technologies and vertical integration in interconnectivity solutions, FIT will target the triangular sweet spots for EV connectivity, with solutions for power connection, data & command connection, as well as human-to-machine connectivity. In 2021, we laid the foundation by pooling resources within the MIH alliance to accelerate our transition to capture the rapidly expanding EV market.
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5G AIoT
We have acquired a leading position in the IaaS industry and developed core technologies over the years. Capitalizing on these advantages, we shall build market leadership in high-speed interconnectivity solutions for IoT and the 5G/6G infrastructure, which supports higher cloud transmission performance and line extension for audio.
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Audio
We are developing high-quality acoustic modules and establishing our presence for the audio supply chain. Leveraging our R&D and vertically integrated manufacturing capability, FIT can provide a full spectrum of partnering solutions – from ODM, OEM to OBM manufacturing for our brand customers.
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3 key industries
Combining FIT‘s rich industrial experience and supply chain advantages, we will continue to improve the development of new products in the 3 key industries and drive profit growth in the future.
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Copper to Optics
The upgrading of data communication technology has spawned a variety of new business application requirements, resulting in an explosive increase in traffic demand. The widespread adoption of fiber optic connectors in the communication infrastructure end market is due to its advantages of low signal attenuation, high speed and noise immunity. Compared to copper connectors, fiber optic connectors can provide more bandwidth and better signal over longer distances as well as reliable data with less interference.
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Wire to Wireless
FIT has been working in the field of networking for over two decades, we keep up with the industry trend of wireless applications. FIT focus on developing technologies of power (wireless charging products) and signal (millimeter wave applications) related application which takes into account both safety and convenience.
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Component to Module
As a leading manufacturer of components, with a certain level of assembly technology, FIT provides services for various world-class brands and private label products across B2C and B2B; we are the world's leading technology and pioneers of technology trends.
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3 key technology areas
In addition to leveraging our own R&D capabilities to deploy the three major technologies, FIT has continuously improved its technological content through alliances, joint ventures and acquisitions, while expanding its technology application fields.
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Manufacturing of high precision components
The manufacturing of connector is characterized by a high degree of precision, and the trend of miniaturization of electronic equipment has increased the demand for professional design of micro connectors, which making FIT's leading position in the ICT industry.
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Connectivity Solutions
Connector products play key role in the performance of electronic products, and are required to have high quality of transmission capabilities involving telecommunications, data, power, and acoustics.
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Rapid Ramp-up Large scale of Manufacturing
In the past, by optimizing resource allocation, FIT was able to rapidly ramp up Large scale in a short period of time, and be able to produce technically complex products on a large scale. Therefore, FIT has accumulated quite a complete experience, and has passed the customer's strict selection of suppliers' audit procedures, making us the favorite of many well-known customers. Key suppliers and strategic relationships with us all demonstrate our strong production capacity and quality.
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Three core technologies
With the core competencies of design and precise manufacturing, quick-to-ramp, high-volume and flexible production capabilities, collaborative relationships with industry-leading customers that integrate our solutions into their design, development and production processes, hon hai group ecosystem provides a unique competitive advantage, experienced and committed management team.
Foxconn Interconnect Technology showcases AI data center connectivity solutions at HHTD24 Hon Hai Technology Day
[Taipei/Hong Kong – October 7, 2024] Foxconn Interconnect Technology (FIT, 6088-HK), a subsidiary of Foxconn Technology Group (2317-TW), participated in the annual flagship event HHTD24 (Hon Hai Tech Day 2024. At this event, FIT showcased a range of innovative products with a primary focus on AI data centers and smart automotive solutions.
2024-10-07
[Taipei/Hong Kong – October 7, 2024] Foxconn Interconnect Technology (FIT, 6088-HK), a subsidiary of Foxconn Technology Group (2317-TW), participated in the annual flagship event HHTD24 (Hon Hai Tech Day 2024. At this event, FIT showcased a range of innovative products with a primary focus on AI data centers and smart automotive solutions. At the AI Data Center exhibition area, FIT introduced a variety of high-performance products, ranging from innovative concept displays to mass-production-ready technologies and solutions. These showcased the company’s strong capabilities in product development, technical advantages, and creative design, solidifying its leadership in the connector industry. One highlight was the high-current connectors and cables, along with liquid cooling quick connectors, which attracted significant attention. In addition to meeting standard regulations, these solutions cater to the next-generation AI racks’ demands for enhanced heat dissipation and current transmission, improving system stability and cooling efficiency. Moreover, FIT is leading the way in technological advancements by collaborating with partners to develop the CPO (Co-Packaged Optics) high-speed interconnect solutions. These solutions, which utilize advanced silicon photonics technology, significantly improve data transmission efficiency and reduce signal attenuation, providing robust support for AI applications. In terms of innovation, FIT’s conceptual FITConn 800G high-speed connector module, a Red Dot Design Award winner, made its physical debut, showcasing a groundbreaking design that eliminates data loss during transmission and dramatically enhances connectivity performance. In the smart automotive sector, FIT's innovative products are designed to enhance driver safety and convenience. First, the Smart Access System uses digital key technology, allowing users to unlock and start their vehicles with a simple tap on their smartphones, eliminating the need for physical keys and reducing the risk of unauthorized access. The HMI/Dashboard platform offers real-time vehicle monitoring, empowering users with greater control. Meanwhile, the mmWave Radar Module can detect potential hazards in real time, ensuring driving safety. The Biometric Monitoring System incorporates biometric technology to comprehensively monitor drivers’ health, helping users make proactive health decisions. Together, these cutting-edge products reinforce FIT’s leadership in the smart automotive field. In addition to technological innovations in AI data centers and smart automotive solutions, FIT’s Belkin products were selected as guest gifts for this event, showcasing the endless possibilities for the future of smart living. The company remains committed to advancing technology and providing more efficient and secure solutions for customers worldwide.
Expands into New Energy with Strategic JV and Launches New Charging Solutions
[Taipei, June 17, 2024] – Foxconn Interconnect Technology Ltd ("FIT", listed on the Hong Kong Stock Exchange under 6088), a subsidiary of Hon Hai (TW.2317), is expanding its presence in the electric vehicle (EV) sector. Following the acquisition of Germany's SWH Group in 2023 and the launch of the Voltaira brand for its mobility solutions portfolio, FIT Hon Teng has formed a joint venture with XYPower Technology Co., Ltd., establishing FXNWING New Energy Technology Co., Ltd. ("FXNWING") to enter the EV charger market.
2024-06-17
[Taipei, June 17, 2024] – Foxconn Interconnect Technology Ltd ("FIT", listed on the Hong Kong Stock Exchange under 6088), a subsidiary of Hon Hai (TW.2317), is expanding its presence in the electric vehicle (EV) sector. Following the acquisition of Germany's SWH Group in 2023 and the launch of the Voltaira brand for its mobility solutions portfolio, FIT Hon Teng has formed a joint venture with XYPower Technology Co., Ltd., establishing FXNWING New Energy Technology Co., Ltd. ("FXNWING") to enter the EV charger market. XY Power, based in Xi'an, specializes in EV charging and energy storage systems. With over 25 years of experience, their expertise in power module design will enhance FXNWING's production capabilities. Combined with FIT Hon Teng's manufacturing strengths, this partnership aims to deliver top-notch charging and energy restorage solutions globally. With growth potential in the EV market, FIT will continue to partner with core technical experts to leverage business opportunities by shortening development times and enhancing the solution packages. Along with the the One-FIT strategy, the strong cooperation between FXNWING and Voltaira has resulted in a new series called Voltaira AC and DC chargers. The debut product Voltaira Anoles AC charger offer 7kW and 22kW charging power and has won the 2024 IF Product Design Award by featuring its interchangeable covers and easy cable and socket replacement to comply with various international standards. Its modular design and improved heat dissipation make it adaptable to different environments. At Europe’s largest smart energy exhibition, Smarter E Europe, on June 19-21, 2024, visitors were able to explore the Voltaira Royal Series. Targeting the Middle East and North Africa (MENA) market, the Royal Series includes DC fast charging stations and AC chargers for commercial and residential use. Designed for harsh climates, these products feature robust protection and intelligent power distribution to achieve high efficiency and reduce operational costs. FXNWING's innovation is further evidenced by the FitPile,the mini DC which has won a Red Dot Design Award. This recognition highlights FIT Hon Teng's commitment to innovation and technical excellence. Visit us at Messe Munchen, Germany (MESSE) C6.635. About FIT (Foxconn Interconnect Technology) Hon Teng (HK.6088) Foxconn Interconnect Technology (FIT), listed on the Hong Kong Stock Exchange, focuses on precision design and manufacturing of connector products as its core. FIT continues to explore 5G AIoT, EV mobility, and audio applications areas, stepping into consumer brand operations. For more information about FIT, please see: www.fit-foxconn.com. Email: fit-ir@fit-foxconn.com sales-usa@fit-foxconn.com
FIT Hong Teng Teams Up with MediaTek to Develop High-Speed Connectivity Solutions Using CPO
[March 25, 2024 - Taipei] AI-generated applications are escalating the demand for higher computing power. In response, Foxconn Interconnect Technology Ltd ("FIT", listed on the Hong Kong Stock Exchange under 6088), a subsidiary of Hon Hai (TW.2317), is joining forces with MediaTek to co-develop a groundbreaking 51.2T solution, inclusive of Co-Packaged Optics (CPO).
2024-03-25
[March 25, 2024 - Taipei] AI-generated applications are escalating the demand for higher computing power. In response, Foxconn Interconnect Technology Ltd ("FIT", listed on the Hong Kong Stock Exchange under 6088), a subsidiary of Hon Hai (TW.2317), is joining forces with MediaTek to co-develop a groundbreaking 51.2T solution, inclusive of Co-Packaged Optics (CPO). CPO is designed to revolutionize the integration of optical transceivers by incorporating them directly onto the same package as the ASIC, moving away from traditional separate modules. Building upon the foundation laid by the Red Dot Design Award-winning FITCONN 800G high-speed connector, FIT seeks to further advance its CPO capabilities by utilizing MediaTek's cutting-edge ASIC platform, which includes high-speed SerDes and silicon photonics technologies. Leveraging FIT's adeptness in CPO socket creation and integration capabilities, this collaboration will deliver superior high-performance computing systems tailored for switches within front-end and back-end networks. Within data centers, CPO is instrumental in increasing bandwidth and reducing electrical pathways, thereby improving latency and accelerating data transmission speeds. The architecture's ability to demonstrate significant total system power savings underscores its value and potential. From a connectivity standpoint, CPO enriches FIT's existing optical communication offerings, spanning 800-1600G, and collaborating with MediaTek will enable the evolution of next-generation network communication technologies. "We are deeply honored to partner with MediaTek on this venture. This trailblazing technology is expected to introduce revolutionary products to the market, ensuring stable and reliable high-speed connectivity solutions," said Mr. Joseph Wang, CTO of FIT Hon Teng. "Anticipating the product's launch, we are committed to collectively furnishing our customers with a broader spectrum of efficient connectivity solutions, thereby propelling the high-performance computing era forward." "MediaTek’s vision is to deliver versatile ASIC platforms to clients, providing them with state-of-the-art technologies designed for the rapidly-expanding data center and server markets,” said Vince Hu, Corporate Vice President at MediaTek. “By working together with FIT on the CPO initiative, we will create new market opportunities by enabling and powering next-generation high-speed transmission solutions.” MediaTek is slated to unveil its product lineup, showcasing FIT's CPO socket, in March 2024 at OFC, the premier global event dedicated to optical communication and networking.
FIT Hong Teng Showcase Innovative E-Bike Products at Taipei Cycle Show 2024.The intersection of technology and fashion takes center stage on two wheels!
[March 5, 2024 - Taipei] FIT Hong Teng (“FIT”, 6088-HK), in partnership with its automotive subsidiary brand Voltaira, unveils its products for the first time at the Taipei Cycle Show. In addition to showcasing E-Bike sensing products. FIT also introduces upgraded models equipped with an integrated E-Bike digital dashboard (FIT E-Bike HMI) and mmWave radar taillight, allowing attendees to be the first to experience the allure of future bicycle technology!
2024-03-05
[March 5, 2024 - Taipei] FIT Hong Teng (“FIT”, 6088-HK), in partnership with its automotive subsidiary brand Voltaira, unveils its products for the first time at the Taipei Cycle Show. In addition to showcasing E-Bike sensing products. FIT also introduces upgraded models equipped with an integrated E-Bike digital dashboard (FIT E-Bike HMI) and mmWave radar taillight, allowing attendees to be the first to experience the allure of future bicycle technology!
In recent years, FIT has actively participated in the electric vehicle industry in collaboration with its parent company Hon Hai (2317-TW), achieving remarkable results in both two-wheel and four-wheel segments. With the addition of the new German automotive team Voltaira, internal resources are further integrated, expanding the product portfolio. This exhibition includes corresponding sensing solutions, highlighting the collaborative efforts.
Beyond that, the team introduces a refreshing design this year, injecting more astonishing elements into the new generation E-Bike digital dashboard. Collaborating with Eagotech, the FIT E-Bike HMI product is installed on actual bikes, featuring a sleek and concise design, providing riders with a more advanced user experience.
FIT has long focused on traditional precision electronic component manufacturing, consistently breaking through conventional manufacturing thinking to bring forth innovative industrial design products. For more information, visit their physical exhibition at the Taipei International Bicycle Show from March 6 to March 9, 2024, located at the Taipei Nangang Exhibition Center Hall 1, booth of the Bicycle and Health Technology Industrial Research and Development Center (K0515).
FIT Unveils 224G Tech at DesignCon 2024: Powering AI and Hyperscale FutureRevolutionizing Data Center Connectivity: FIT Unveils 224G Data Rates at DesignCon 2024 - A Leap Forward in AI and Machine Learning Era
[Santa Clara, 2023/01/29] – Foxconn Interconnect Technology (FIT), a frontrunner in the data center connectivity industry, proudly announces the launch of its 224G data rates for high-speed I/O and near-chip connectivity at this year's DesignCon. This groundbreaking development in 224G signifies a strategic step forward, preparing FIT and its key customers for the burgeoning data rates propelled by advancements in AI and machine learning.
2024-01-29
[Santa Clara, 2023/01/29] – Foxconn Interconnect Technology (FIT), a frontrunner in the data center connectivity industry, proudly announces the launch of its 224G data rates for high-speed I/O and near-chip connectivity at this year's DesignCon. This groundbreaking development in 224G signifies a strategic step forward, preparing FIT and its key customers for the burgeoning data rates propelled by advancements in AI and machine learning.
The 224G standard demands exceptional levels of signal integrity, mechanical robustness, and manufacturing precision. Terry Little, Development Engineering Manager and System Architect at FIT, states, "connectors with 224G interfaces require innovative design approaches, extending beyond conventional development norms. This necessitates creative thinking in electrical contact design, tighter mechanical and manufacturing tolerances, and more stringent assembly processes." FIT is dedicated to offering these specialized capabilities to the industry, providing crucial thermal and mechanical design guidance for QSFP-DD1600 and OSFP MSAs.
Alex An, Senior Director of Business Development at FIT, emphasizes, “Our amalgamation of industry experience near the chip, extensive manufacturing knowledge, and expertise in high-volume automation creates the perfect synergy to significantly contribute to high-speed MSAs or consortiums. These components are essential in driving AI, hyperscale, and enterprise solutions. FIT stands out in its ability to pioneer and scale copper connectivity solutions originating from the chip, including co-packaged solutions, near-chip connectors, and 224G internal cabling to IO.”
FIT is swiftly progressing in the development of near- or on-chip connectivity. With the expansion of the back-end network, there's a pressing need to move beyond traditional board layers.
Alex adds, “The challenge extends beyond high speed – managing power is also a critical hurdle. As a provider of connector solutions, our focus is on integrating high power density into mission-critical components without sacrificing other architectural aspects. Collaborating with our clients to solve these pivotal challenges remains a primary focus of our efforts.”
Aligned with its '3+3 strategy', FIT is concentrating its resources on key markets such as Electric Vehicles (EVs), Audio, and 5G AIoT to foster margin growth. The company is enthusiastic about showcasing its latest innovations at DesignCon 2024, underscoring its commitment to its customers and their growth in these vital sectors.
For more information about FIT and its innovative solutions, please visit booth 619 at DesignCon 2024.
FIT Showcases Multi-Gig Automotive Ethernet Cable and Connector Solutions at DesignCon 2024.10G multi-gigabit Automotive Ethernet link to be demonstrated over a 15-meter cable using Broadcom PHY technology.
Santa Clara, Calif., January 29, 2024 -- Foxconn Interconnect Technology (6088.HK) (“FIT”), a leading connective solution provider creating powerful connections for a better world, today announced the demonstration of its 10G multi-gigabit Automotive Ethernet cable and connector solutions at the DesignCon 2024 exhibition in Santa Clara, California from January 30th to February 1st.
2024-01-28
Santa Clara, Calif., January 29, 2024 -- Foxconn Interconnect Technology (6088.HK) (“FIT”), a leading connective solution provider creating powerful connections for a better world, today announced the demonstration of its 10G multi-gigabit Automotive Ethernet cable and connector solutions at the DesignCon 2024 exhibition in Santa Clara, California from January 30th to February 1st. FIT’s FoxNet GII Multi-Gig Automotive Ethernet Connector and Cable will appear together with Broadcom’s 10G PHY Automotive Ethernet Evaluation Board. This demo will feature Broadcom’s BCM89890 multi-gigabit Automotive Ethernet PHY chip, connected with FIT’s 15-meter Foxnet GII Multi-Gig Cable, which includes 4 in-line connectors. This cable link supports the IEEE 802.3ch specification which is rated for 2.5, 5 and 10 Gbps for Automotive Ethernet applications and compliant with OPEN Alliance TC9 standard for Single Pair Ethernet (SPE). The IEEE 802.3ch specification also identifies a maximum length 15-meter cable assembly, with up to 4 in-line connectors. FIT’s FoxNet GII connector and cable family includes (1) Single Port Configuration (as shown in the demo), (2) In-Line Connector Configuration (as shown in the demo), (3) 2x2 (4 port) Connector Configuration, and (4) 1x2 (2port) Connector Configuration. FIT will be conducting a live demonstration of its 10G multi-gigabit Automotive Ethernet link over a 15-meter cable assembly in the FIT Booth #619. This live demo will continuously monitor the bit error rate (BER) across the 15-meter cable length (with 4 in-lines), sending and receiving packets of data continuously. Applications: ‧ Domain Controller, Gateway (Zonal Architecture) ‧ Advanced Driver Assistance Systems ‧ 4D Radar ‧ Lidar ‧ High-resolution 4K Displays ‧ Rear Seat Entertainment ‧ 4K Camera Systems ‧ Intelligent Headlight
About FIT Hon Teng Foxconn Interconnect Technology (FIT) is a leading global solutions developer and manufacturer, cultivating connectivity for a better world. With unsurpassed capabilities in development, research, manufacturing engineering and design, production, supply chain, and go-to-market planning for world class brands and private label products spanning B2C and B2B categories, FIT is at the forefront of worldwide technological trends delivering compelling user experiences at scale. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components. For more information, visit FIT’s website: https://www.fit-foxconn.com.
