FIT Voltaira Group Completes Acquisition of Auto-Kabel Group
FIT Voltaira Group (Voltaira), a leading system supplier of sensor, connectivity, and electrification solutions, specializing in wire harness technologies, today announced the completion of its acquisition of Auto-Kabel Group as of November 29, 2024. Auto-Kabel, based in Hausen im Wiesental, Germany (Baden-Wurttemberg), is a pioneer in e-mobility and a technology leader in automotive power distribution and management.
2024-12-02
Reutlingen, Germany-FIT Voltaira Group (Voltaira), a leading system supplier of sensor, connectivity, and electrification solutions, specializing in wire harness technologies, today announced the completion of its acquisition of Auto-Kabel Group as of November 29, 2024. Auto-Kabel, based in Hausen im Wiesental, Germany (Baden-Wurttemberg), is a pioneer in e-mobility and a technology leader in automotive power distribution and management. The acquisition, previously announced on July 11, 2024, significantly strengthens Voltaira’s product portfolio in intelligent energy distribution systems, including innovative battery harnesses, busbars, and high-voltage vehicle electrical systems. The combined entity, Voltaira, will now boast a global presence, with more than 50 locations across Europe, Asia, North America and Africa, and over 11,500 people worldwide. “We are delighted to welcome the Auto-Kabel Group to the Voltaira family,” said Chris Lu, Global COO of FIT Group and Managing Director of Voltaira. “This strategic acquisition solidifies our commitment to electrified vehicle technology and reinforces our dedication to pioneering solutions. Our customer knowledge and expertise with both OEMs and mobility suppliers will empower us to uniquely address the evolving needs of both audiences, positioning us at the forefront of the industry.” Going forward, the Auto-Kabel brand will operate under the name Voltaira AutoKabel , reflecting its integration into the Voltaira Group while respecting its historical significance in the mobility market. This rebranding will leverage the strength of the Voltaira brand while honoring Auto-Kabel’s legacy and industry expertise. “We are incredibly excited to join Voltaira ,” said Jens Schumacher, CSO of Auto-Kabel Group. “This partnership is built on a shared commitment to quality, innovation, and deep industry expertise. We see a promising future ahead, and the synergies between our businesses will enhance our product offerings and drive sustainable growth.” The acquisition was made through a wholly owned German SPV of Foxconn Interconnect Technology GmbH, the holding company of FIT Voltaira Group GmbH. Voltaira, owned by Foxconn Interconnect Technologies Limited (“FIT”), benefits from a solid financial foundation that supports growth in the rapidly evolving automotive market.
About Voltaira Group At Voltaira Group, we drive the future of sustainable mobility with creative solutions and cutting-edge technology. As an established system supplier in the mobility industry, we are proud of our long-standing partnerships with major Tier 1 automotive suppliers and OEMs. Our core competencies include the design, development and manufacture of sensor, connectivity, and electrification solutions for the automotive and micro-mobility sectors. Recognized for our commitment to quality and German engineering excellence, the Voltaira brand is trusted worldwide. Through our strategic partnerships, we offer endless possibilities in mobility, from charging solutions to 5G AIoT. The Voltaira Group operates globally with more than 50 sites in Europe, Asia, North America and Africa, employing more than 11,500 people. About Auto-Kabel Group Auto-Kabel Group is an international leader in electromobility, with 90 years of innovation and top-tier manufacturing quality. Auto-Kabel Group supplies electrical components for automotive systems and power distribution, focusing on e-mobility solutions. As a system supplier, Auto-Kabel Group offers a wide range of products, including charging sockets, drive cables, and battery connectors, to customers worldwide.
About Foxconn Interconnect Technology (FIT Hon Teng) Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Asia. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, Mobility, and Audio, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com
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Ministry of Energy Announces Joint Venture Between Saleh Suleiman Alrajhi & Sons and Foxconn Interconnect Technology to Advance Vision 2030 with Future Plans for Locally-made EV Chargers.
Riyadh, Saudi Arabia –Ministry of Energy has announced the formation of a groundbreaking joint venture between Saleh Suleiman Alrajhi & Sons and Foxconn Interconnect Technology (FIT), a highly esteemed global manufacturer to support the Kingdom's Vision 2030. The partnership aims to produce Saudi-made electric vehicle (EV) charging stations, strengthening Saudi Arabia’s leadership in renewable energy and technological innovation.
2024-10-23
From left to right, Suleiman AlRajhi, H.E. Bandar Alkhorayef (Minister of Industries and Mineral Resources),Sidney Lu(FIT CEO), H.E. Prince Abdulaziz bin Salman Al-Saud (Minister of Energy), H.H. Prince Fahad al Saud, H.E. DR. Hamad Al AlSheik(Minister of State), Louie Yeh
Riyadh, Saudi Arabia –Ministry of Energy has announced the formation of a groundbreaking joint venture between Saleh Suleiman Alrajhi & Sons and Foxconn Interconnect Technology (FIT), a highly esteemed global manufacturer to support the Kingdom's Vision 2030. The partnership aims to produce Saudi-made electric vehicle (EV) charging stations, strengthening Saudi Arabia’s leadership in renewable energy and technological innovation.
This partnership is endorsed by Prince Abdulaziz bin Salman Al-Saud, Minister of Energy; Mr. Bandar Alkhorayef, Minister of Industry and Mineral Resources; and Mr. Hamad Al Sheikh, a government minister, reflecting strong support from the Saudi authorities
On behalf of Saleh Suleiman Alrajhi & Sons, Next Charger, the company’s subsidiary, has accumulated highly respected experience in the local charging pile industry. The collaboration with major European brands and local distributors has contributed extensive practices which will be leveraged in the joint venture, providing valuable insights and proven strategies for success.
The signing ceremony is inaugurated by H.H. Prince Fahad bin Nawaf Al Saud who emphasized his shared vision under the leadership of HRH the crown prince Mohammad Bin Salman. “We are committed to creating a sustainable and diverse future for the Kingdom,” Prince Fahad declared. By sharing his perspective as a forward-thinking entrepreneur and prestigious market leader, H.H.Prince Fahad envisions the joint venture as pivotal in driving the growth of electric mobility across Saudi Arabia.
FIT, a subsidiary of Foxconn Technology Group, has comprehensive charging solutions evidencing its excellent design capability for power modules and top-notch manufacturing capability. “By reducing the Kingdom’s reliance on imports and fostering domestic expertise, we can boost job creation and enhance the country’s technological self-sufficiency. Partnering with FIT is a strategic step toward local manufacturing,” Said Suleiman AlRajhi, Chairman of Saleh Suleiman Alrajhi & Sons.
FIT has already achieved significant milestones, including the certification of its AC charger by the Saudi Standards, Metrology and Quality Organization (SASO). Their award-winning design team, recipient of the 2024 IF Design Award and Red Dot Award, will bring unparalleled customization options to the joint venture, tailoring charger designs to meet market preferences. Louie Yeh, Head of FIT’s charging pile business, commented: “Our joint venture will prioritize the development of high-quality charging stations designed for optimal performance in Saudi Arabia’s unique environmental conditions. Given the intense sunlight, our products underwent UV testing to ensure durability.”
The signing ceremony also underscored the partnership’s broader impact, extending beyond technological innovation to focus on talent development for the Kingdom’s future. Mr. Andreas Cangellaris, Founding President of NEOM University, was in attendance, reuniting with Sidney Lu, Chairman & CEO of FIT. Both men share a strong connection to the University of Illinois Urbana-Champaign (UIUC), where Lu’s contributions led to the renaming of the Mechanical Engineering Building in his honor, and where Mr. Cangellaris previously served as Provost before joining NEOM.
This joint venture not only represents a critical step forward for the Kingdom’s renewable energy sector but also underscores a commitment to shaping the next generation of skilled professionals. "Through this partnership, we aim to drive innovation in EV charging solutions while cultivating local talent, aligning with Vision 2030’s goals of creating a sustainable, diversified economy," the companies jointly stated.
About Saleh Suleiman Alrajhi & Sons Saleh Suleiman Alrajhi & Sons, established in 2011, is a prominent and well-established family business in Saudi Arabia. Their business dates back to 1957 when the world’s first Islamic bank was established. Over the years, the family has played a significant role in the country’s economic reforms and initiatives. With a diverse portfolio spanning healthcare, construction, steel and manufacturing, and technology, Alrajhi is driving growth through strategic partnerships with global industry leaders, embracing innovative practices, and incorporating a range of perspectives to boost its competitiveness on the international stage. The company also invests in promising future technologies that align with Vision 2030.
About Foxconn Interconnect Technology (FIT Hon Teng) Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com
Voltaira to Showcase Comprehensive Mobility Solutions and Product Lifecycle Expertise at IZB 2024
Voltaira Group, a leading provider of sensor, connectivity, and electrification solutions specializing in wire harness technologies, is proud to announce its participation at the International Suppliers Fair (IZB) 2024, taking place in Wolfsburg, Germany. At the event, Voltaira will unveil its comprehensive solutions portfolio and highlight its product lifecycle management expertise, reinforcing its pivotal role in shaping the future of sustainable mobility.
2024-10-21
Voltaira to Showcase Comprehensive Mobility Solutions and Product Lifecycle Expertise at IZB 2024
October 21, 2024 | Wolfsburg, Germany
Voltaira Group, a leading provider of sensor, connectivity, and electrification solutions specializing in wire harness technologies, is proud to announce its participation at the International Suppliers Fair (IZB) 2024, taking place in Wolfsburg, Germany. At the event, Voltaira will unveil its comprehensive solutions portfolio and highlight its product lifecycle management expertise, reinforcing its pivotal role in shaping the future of sustainable mobility.
Backed by a strong foundation in automotive technologies and leveraging the advanced electronics capabilities of its parent company, Foxconn Interconnect Technologies (FIT), Voltaira is at the forefront of transforming the automotive and micro-mobility sectors. The company delivers cutting-edge connectivity system solutions for the next generation of vehicles.
Introducing its end-to-end solution portfolio
At IZB 2024, Voltaira will present its complete range of offerings, underscoring its leadership in sensor technology, connectivity, and electrification. As part of the FIT Group, Voltaira’s portfolio spans the entire product lifecycle — from concept design and co-development to manufacturing and end-of-life services — empowering mobility original equipment manufacturers (OEMs) and suppliers to innovate efficiently and with agility.
“We are excited to demonstrate how our European heritage and automotive expertise, combined with the agility and innovation of the Asian players, allow us to bring a fresh perspective to the industry,” said Ulrich Eichler, CEO of Voltaira Group. “From advanced charging solutions to integrated connectivity systems, our products address today’s key challenges while laying the foundation for future innovations.”
Embracing creative solutions and cutting-edge technology
As the automotive industry continues its digital transformation, Voltaira is capitalizing on key megatrends, including electrification, connectivity, micromobility, and autonomous driving. Mobility players today face challenges like need for implementing parallel technologies, extreme cost-effectiveness, space constraints, and the integration of disparate supplier products. Voltaira’s strength lies in turning these challenges into opportunities through its creativity and commitment to innovative connectivity solutions, global coverage and in-houe value chain.
A strategic partnership with Foxconn Interconnect Technologies (FIT)
As a subsidiary of Foxconn Interconnect Technologies (FIT), Voltaira blends its automotive engineering excellence with FIT’s leadership in electronics and precision manufacturing. This synergy offers the automotive sector an unparalleled value proposition, combining the best of both industries.
“With FIT’s expertise in smart devices, 5GAIoT, and audio, Voltaira is positioned at the forefront of the convergence of automotive and electronics, Together, we are shaping the future of mobility with solutions that are smarter, safer, and more sustainable.”
Shaping the future of sustainable mobility
Voltaira’s vision extends beyond connectivity and electrification. The company is actively developing forward-thinking solutions for the broader mobility ecosystem, including intelligent charging infrastructures and innovative electrification systems.
Visit Voltaira at IZB 2024! Voltaira invites all attendees to visit its booth at IZB 2024 to explore its solutions portfolio, experience live demonstrations, and discuss collaboration opportunities.
Event Details:
Date: October 22-24, 2024 Location: IZB, Wolfsburg, Germany Booth: 3105, Hall 3 For more information about Voltaira’s participation at IZB 2024 or to schedule a meeting, please visit www.voltaira-group.com or contact Bernadett Torok, Global Director of Marketing and Communications (press.services@voltaira-group.com).
FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
Hong Kong – October 16, 2024 – FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers.
2024-10-16
Hong Kong – October 16, 2024 – FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers. At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT’s AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads. Key product highlights include: 224G+ sockets for XPU/GPU connectivity Co-packaged copper and optical architectures Power cables for ORV3 Active Optical Cables (AOC) OSFP1600 and QSFP-DD port configurations These solutions underscore FIT’s commitment to driving innovation in the AI data center space, building on Foxconn’s extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers. In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms.” The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers. By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions.
FIT Hon Teng Showcases AI Data Center Connectivity and Immersion-Cooled Signal Integrity Solutions at OCP Global Summit 2024
Hong Kong – October 16, 2024 – FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers.
2024-10-16
Hong Kong – October 16, 2024 – FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Precision Industry (2317-TW), will unveil its latest advancements in AI data center connectivity and immersion-cooling technologies at the upcoming 2024 OCP Global Summit. Hosted by the Open Compute Project (OCP), this prestigious event brings together global leaders in hardware infrastructure design, addressing the evolving demands of modern data centers. At the summit, FIT will introduce solutions that tackle critical challenges in AI-driven data centers, including signal degradation, heat dissipation, and large-scale manufacturing scalability. FIT’s AI rack connectivity innovations are designed to enhance signal integrity and optimize data transmission, all while incorporating advanced cooling technologies for high-density AI workloads. Key product highlights include: 224G+ sockets for XPU/GPU connectivity Co-packaged copper and optical architectures Power cables for ORV3 Active Optical Cables (AOC) OSFP1600 and QSFP-DD port configurations These solutions underscore FIT’s commitment to driving innovation in the AI data center space, building on Foxconn’s extensive industrial internet expertise to offer cutting-edge AI connectivity solutions to global data center customers. In addition to its AI connectivity offerings, FIT will present its immersion-cooled IT platform solutions at the summit. Terry Little, Development Engineering Manager at FIT, will lead a session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms.” The session will delve into the effects of dielectric fluids on high-speed signal lines, the challenges of high-speed testing in such environments, and innovative connector fixture strategies. These solutions are critical for ensuring reliable performance in harsh, high-density computing environments, such as AI data centers. By addressing key issues such as performance, efficiency, and scalability, FIT continues to play a pivotal role in supporting the growth of AI infrastructure across industries, further solidifying its leadership in AI data center solutions.
Foxconn Interconnect Technology showcases AI data center connectivity solutions at HHTD24 Hon Hai Technology Day
[Taipei/Hong Kong – October 7, 2024] Foxconn Interconnect Technology (FIT, 6088-HK), a subsidiary of Foxconn Technology Group (2317-TW), participated in the annual flagship event HHTD24 (Hon Hai Tech Day 2024. At this event, FIT showcased a range of innovative products with a primary focus on AI data centers and smart automotive solutions.
2024-10-07
[Taipei/Hong Kong – October 7, 2024] Foxconn Interconnect Technology (FIT, 6088-HK), a subsidiary of Foxconn Technology Group (2317-TW), participated in the annual flagship event HHTD24 (Hon Hai Tech Day 2024. At this event, FIT showcased a range of innovative products with a primary focus on AI data centers and smart automotive solutions. At the AI Data Center exhibition area, FIT introduced a variety of high-performance products, ranging from innovative concept displays to mass-production-ready technologies and solutions. These showcased the company’s strong capabilities in product development, technical advantages, and creative design, solidifying its leadership in the connector industry. One highlight was the high-current connectors and cables, along with liquid cooling quick connectors, which attracted significant attention. In addition to meeting standard regulations, these solutions cater to the next-generation AI racks’ demands for enhanced heat dissipation and current transmission, improving system stability and cooling efficiency. Moreover, FIT is leading the way in technological advancements by collaborating with partners to develop the CPO (Co-Packaged Optics) high-speed interconnect solutions. These solutions, which utilize advanced silicon photonics technology, significantly improve data transmission efficiency and reduce signal attenuation, providing robust support for AI applications. In terms of innovation, FIT’s conceptual FITConn 800G high-speed connector module, a Red Dot Design Award winner, made its physical debut, showcasing a groundbreaking design that eliminates data loss during transmission and dramatically enhances connectivity performance. In the smart automotive sector, FIT's innovative products are designed to enhance driver safety and convenience. First, the Smart Access System uses digital key technology, allowing users to unlock and start their vehicles with a simple tap on their smartphones, eliminating the need for physical keys and reducing the risk of unauthorized access. The HMI/Dashboard platform offers real-time vehicle monitoring, empowering users with greater control. Meanwhile, the mmWave Radar Module can detect potential hazards in real time, ensuring driving safety. The Biometric Monitoring System incorporates biometric technology to comprehensively monitor drivers’ health, helping users make proactive health decisions. Together, these cutting-edge products reinforce FIT’s leadership in the smart automotive field. In addition to technological innovations in AI data centers and smart automotive solutions, FIT’s Belkin products were selected as guest gifts for this event, showcasing the endless possibilities for the future of smart living. The company remains committed to advancing technology and providing more efficient and secure solutions for customers worldwide.
FIT Hon Teng Acquires 70% Stake in Ccloud China Cloud Electro Optics Technology Co – Strengthening Global Optical Speed Capabilities with a RMB 220 Million Investment
[Taipei – August 5, 2024] Foxconn Interconnect Technology Ltd ("FIT", listed on the Hong Kong Stock Exchange under 6088), a subsidiary of Hon Hai (TW.2317), today announced the acquisition of a 70% stake in China Cloud Electro Optics Technology Co. Ltd ("Ccloud"), for RMB 220 million. This strategic move further strengthens FIT’s position in the high-speed optical module and Co-Packaged Optics (CPO) technology market. The acquisition comes in response to the increasing demand for optical communication driven by AI advancements. AI data centers are accelerating the demand for 400G/800G optics, with the market surpassing $4.5 billion by 2024, representing half of the total optical communication market.
2024-08-05
[Taipei – August 5, 2024] Foxconn Interconnect Technology Ltd ("FIT", listed on the Hong Kong Stock Exchange under 6088), a subsidiary of Hon Hai (TW.2317), today announced the acquisition of a 70% stake in China Cloud Electro Optics Technology Co. Ltd ("Ccloud"), for RMB 220 million. This strategic move further strengthens FIT’s position in the high-speed optical module and Co-Packaged Optics (CPO) technology market. The acquisition comes in response to the increasing demand for optical communication driven by AI advancements. AI data centers are accelerating the demand for 400G/800G optics, with the market surpassing $4.5 billion by 2024, representing half of the total optical communication market.
The integration of Ccloud will significantly accelerate the development timeline for FIT's optical products: multi-mode optical products by the third quarter of 2024, including 800G QDD, OSFP AOC, SR8, and LPO (1 to 100 meters); single-mode products such as 800G DR8 2xFR4 (500 meters to 2 kilometers) are anticipated to be finalized by the fourth quarter of 2024. All these products will adopt silicon photonics technology. By the end of 2025, FIT aims to complete the development of 1.6T SR8/DR8 optical products. Ccloud is equipped with the capability for large-scale production of 100G to 800G optical modules, which cover more than 80% of the optical communication market. The company's core staff come from top-tier optical communication companies with over 30% of employees dedicated to innovation development and engineering.
The collaboration between FIT and Ccloud brings highly complementary resources: FIT has a strong international customer base and extensive overseas manufacturing capabilities, while Ccloud is equipped with a top-tier R&D center and a comprehensive pilot and mass production base in Wuhan. The two companies have already started large-scale shipments of 800G OSFP SR8 modules to major North American customers, laying a solid foundation for future cooperation.
In 2024, FIT has made rapid progress in AI-related products. Building on its strengths in high-speed copper products, FIT showcased its 224G solution at DesignCon earlier this year and won the 2023 Red Dot Design Award for its innovative 800G high-speed connectors under the “FITCONN” brand. The development of optical products is also on track, with FIT leveraging its brand strength and collaborating with MediaTek to develop high-speed and next-generation CPO (Co-Packaged Optics) solutions. Simultaneously, FIT is working with upstream chip manufacturers to develop 1.6T solutions.
Alex An, Sr. Director of Business Development, stated, "This partnership will mutually benefit both companies by accelerating our ability to serve upcoming projects in the AI and networking markets. By combining FIT’s strength in industrializing connectors and scaling high-speed connectivity products with ccloud’s expertise in optics, we can sharpen our focus on customer design support, product quality, and geographically diverse supply chains. FIT is enthusiastic about partnering with Ccloud to embrace the future of AI data center connectivity.” Ccloud CEO Zhai Hong Gang added, "We will continue to uphold the spirit of open collaboration, working together to drive the application and development of AI optical module technology, contributing to a beautiful digital and intelligent future. Through highly complementary and in-depth cooperation, we are confident in continuously launching new AI technology applications, rapidly capturing market share, and becoming a rising star in the industry."
About FIT (Foxconn Interconnect Technology) Hon Teng (HK.6088)
FIT Hon Teng (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. With a core focus on connector products, FIT has strategically expanded into 5G AIoT, electric vehicles, and acoustic electronic components in recent years, while also venturing into consumer brand management. For more information, please visit the company’s website at www.fit-foxconn.com. For more information about FIT, please see: www.fit-foxconn.com. Email: fit-ir@fit-foxconn.com sales-usa@fit-foxconn.com
