San Jose, California – May 13, 2025 – Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, is proud to announce its continued support for Broadcom’s co-packaged optics (CPO) initiative. FIT is now delivering key hardware components that are integral to the success of Broadcom’s Tomahawk 5 (TH5) Bailly platform, including advanced solderless LGA-to-LGA sockets and Remote Pluggable Laser Source (PLS) I/O cages, alongside specialized connector assemblies.
2025-05-13
San Jose, California – May 13, 2025 – Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, is proud to announce its continued support for Broadcom’s co-packaged optics (CPO) initiative. FIT is now delivering key hardware components that are integral to the success of Broadcom’s Tomahawk 5 (TH5) Bailly platform, including advanced solderless LGA-to-LGA sockets and Remote Pluggable Laser Source (PLS) I/O cages, alongside specialized connector assemblies. These critical CPO components, now in full-scale production, are designed to meet the demanding performance, scalability, and integration requirements of next-generation data center optical architectures. With their superior design, FIT’s solutions enable seamless system integration, simplified assembly, and long-term maintainability. Precision Interconnect Solutions for Advanced Data Center Networks FIT’s high-performance, solderless LGA-to-LGA sockets provide a simplified yet robust solution for integrating Broadcom’s switch ASICs into high-density systems. This innovation eliminates the need for traditional soldering, enabling faster and more flexible assembly while ensuring consistent yield and reliability. The solderless connection also ensures the stability and scalability of data center deployments as optical networks evolve. Additionally, FIT’s PLS I/O cages and connector assemblies are engineered to withstand the thermal and mechanical challenges of high-speed optical environments. These components play a critical role in Broadcom’s vision for laser-disaggregated switch architectures, enabling significant power savings, bandwidth density, and performance scaling for hyperscale data centers. Broadcom: A Trusted Partner in CPO Innovation “We are proud to partner with Foxconn Interconnect Technology as a key enabler in the advancement of the TH5-Bailly CPO platform,” said Alvin Low, Director of Silicon Photonics Engineering, Optical Systems Division, Broadcom. “FIT’s expertise in precision interconnects and system integration is essential to the successful scale-out of our CPO technology in hyperscale environments. Their innovative components are central to the continued evolution of data center optical networking.” Looking Ahead: Collaborating on Next-Generation CPO Platforms FIT’s role extends beyond the current phase, as the company is actively involved in developing next-generation 200-Gbps per lane CPO platform components. By leveraging FIT’s deep expertise in socket design, optical I/O, and mechanical systems, the two companies are committed to addressing the rapidly growing demands of AI and high-performance computing (HPC) workloads.
"We are proud to partner with Foxconn Interconnect Technology as a key enabler in the advancement of the TH5-Bailly CPO platform," said Alvin Low, Director of Silicon Photonics Engineering, Optical Systems Division, Broadcom. "FIT's expertise in precision interconnects and system integration is essential to the successful scale-out of our CPO technology in hyperscale environments. Their innovative components are central to the continued evolution of data center optical networking."
Looking Ahead: Collaborating on Next-Generation CPO Platforms
FIT's role extends beyond the current phase, as the company is actively involved in developing next-generation 200-Gbps per lane CPO platform components. By leveraging FIT's deep expertise in socket design, optical I/O, and mechanical systems, the two companies are committed to addressing the rapidly growing demands of AI and high-performance computing (HPC) workloads.
"We are proud to partner with Foxconn Interconnect Technology as a key enabler in the advancement of the TH5-Bailly CPO platform," said Alvin Low, Director of Silicon Photonics Engineering, Optical Systems Division, Broadcom. "FIT's expertise in precision interconnects and system integration is essential to the successful scale-out of our CPO technology in hyperscale environments. Their innovative components are central to the continued evolution of data center optical networking."
"We are excited to our collaboration with Boardcom to shape the next-generation of 200G CPO solutions," said Alex An, Senior Director of Business Development, Foxconn Interconnect Technology. "Together, we are focused on enabling scalable AI infrastructure with cutting-edge interconnect solutions that combine reliability, power efficiency, and forward-thinking design."
Showcasing the Future of CPO Technology at Computex 2025 As part of their continued partnership, FIT will be showcasing illustrative samples of the LGA sockets and I/O modules at Computex 2025. These innovative solutions will be available for qualified platform developers looking to build the next-generation of AI-driven data center infrastructure.
