FIT (Foxconn Interconnect Technology) Makes Its Debut at DesignCon 2026: Launching Its 448G CHIPLINK® Solution, Leading a Revolution in AI Data Center Computing Power
[Santa Clara, CA – February 23, 2026] – Foxconn Interconnect Technology (FIT, 6088-HK), a leading provider of connectivity solutions under Hon Hai Technology Group (2317-TW), will showcase its latest innovations at DesignCon 2026 (Booth #719) from February 24–26. Addressing the surging power demands of the AI era, FIT is presenting its vision, "Shaping the Future of Data and Power: From Chips to Grid," featuring comprehensive AI data center solutions including 1.6T interconnects, Next-Gen CHIPLINK® 448G Solutions and next-generation liquid cooling technologies.
2026-02-23
[Santa Clara, CA – February 23, 2026]
Foxconn Interconnect Technology (FIT, 6088-HK), a leading provider of connectivity solutions under Hon Hai Technology Group (2317-TW), will showcase its latest innovations at DesignCon 2026 (Booth #719) from February 24–26. Addressing the surging power demands of the AI era, FIT is presenting its vision, "Shaping the Future of Data and Power: From Chips to Grid," featuring comprehensive AI data center solutions including 1.6T interconnects, Next-Gen CHIPLINK® 448G Solutions and next-generation liquid cooling technologies.
Where Tech Aesthetics Meet Performance: Comprehensive Adaptability
FIT’s booth features a refreshed corporate identity, highlighted by a futuristic geometric angled archway that serves as a bridge between visitors and the technology on display. The design uses layered lines to symbolize the convergence of signals, energy, and information. The layout guides visitors through a narrative journey, showcasing FIT’s ability to integrate connectivity across the entire spectrum — from the power grid down to the silicon chip.
Five Core Highlights: Defining Next-Gen High-Speed Transmission
At this exhibition, FIT is fully promoting its critical technologies specifically designed for AI and High-Performance Computing (HPC) architectures:
1.6T High-Speed Interconnects: Engineered for next-generation AI architectures, providing ultra-high-density bandwidth to satisfy extreme instantaneous data transfer requirements.
Next-Gen CHIPLINK® 448G Solutions: Specifically designed to address the escalating signal integrity, high density, and mechanical integration challenges of 224G and 448G AI/HPC systems. The CHIPLINK® CPC (Cabled Protein Card) architecture utilizes a socketed modular wafer design supporting 30–34 AWG cabling, offering flexible scaling for CPC-to-I/O, CPC-to-CPC, and CPC-to-Backplane topologies. This solution optimizes high-density differential pair routing while significantly improving insertion loss (IL) and crosstalk performance.
Advanced Liquid Cooling: Superior thermal management performance tailored for hyperscale data centers and AI clusters to combat the heat challenges of rising compute density.
PCIe® 6.0 / 7.0 Cabling Solutions: High-performance, low-latency expansion options that optimize connectivity efficiency for AI computing resources.
RF Waveguide Interconnects: Developed in collaboration with Point2 Technology, these cutting-edge high-frequency solutions offer an alternative to traditional copper and fiber, effectively addressing power consumption, reach, and integration hurdles at extreme data rates.
Breaking Physical Barriers: Power Management as the Key to HPC
"The challenge today is no longer just about raw speed; power management is the core priority," said Joseph Wang, CTO of FIT, regarding the structural challenges of AI computing. "Through advanced connectivity, we are committed to helping customers seamlessly integrate high-power components into key AI rack locations without overhauling existing architectures. This ensures data transmission at ultra-low latency while overcoming the physical limits of signal loss."
A Milestone in Transformation: From Components to High-End AI Solutions
FIT’s presence at DesignCon 2026 marks a significant milestone in its evolution from a traditional component manufacturer to a provider of high-end AI computing solutions. Visit us at DesignCon, booth No. 719, where our professional team will present a full range of high-speed data and power transmission solutions.
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at https://www.fit-foxconn.com/.
