FIT Sets New AI Interconnect Benchmark at OFC 2026 Advancing from 1.6T Production to Integrated Photonic–Electronic– Thermal Systems
Los Angeles, March 17, 2026 — FIT Hon Teng Limited (06088.HK), a subsidiary of the Foxconn Technology Group, today showcased its latest innovations in AI high-speed interconnect technologies at Optical Fiber Communication Conference (OFC) 2026, South Hall – Booth 1558, signaling the company’s evolution from a connectivity component supplier to a provider of integrated photonic, electronic, and thermal system solutions for next-generation AI infrastructure.
2026-03-17
Los Angeles, March 17, 2026
FIT Hon Teng Limited (06088.HK), a subsidiary of the Foxconn Technology Group, today showcased its latest innovations in AI high-speed interconnect technologies at Optical Fiber Communication Conference (OFC) 2026, South Hall – Booth 1558, signaling the company’s evolution from a connectivity component supplier to a provider of integrated photonic, electronic, and thermal system solutions for next-generation AI infrastructure.
A key highlight is FIT’s live demonstration of its XPO Loopback Connector and Cage with a Host Compliance Board, transmitting at 224 Gbps at Arista Networks (South Hall, Booth 1571) and highlighting insertion and return loss performance. The demo supports the debut of the XPO MSA, with FIT participating as a contributing partner to the ecosystem.
“With the introduction of the XPO Interconnect, the industry takes an important step forward in enabling scalable, high-bandwidth AI infrastructure. XPO brings together advanced cable modules, high-density connector technology, and liquid cooling, to support the high data rate performance and thermal requirements of next-generation computing systems,” says Terry Little, Product Development Engineering Manager and System Architect at FIT.
FIT also introduced an upgraded 2.0 version of its 102.4T ELSFP external laser source module, designed for the Tomahawk-6 CPO architecture. The new generation delivers up to 26 dBm output power per channel and supports 16-channel 1.6T applications. The previous generation 102.4T ELSFP external laser module has already been validated by NTT Innovative Devices. Building on its 51.2T platform, FIT has further enhanced optical coupling precision, connector reliability, and thermal design to ensure scalability and longterm operational stability in large-scale AI deployments.
In addition, FIT has also announced its CPX 500-pin socket solution for designed with NTT Innovative Devices, specifically engineered to meet next-generation AI and HighPerformance Computing (HPC) interconnect requirements at 224G and 448G per lane. This high-density, ultra-thin socket solution facilitates scalable connectivity for advanced switch tray scale-out applications. Jointly designed for superior signal integrity, precise impedance control, and optimized insertion loss, the CPX solution delivers enhanced mechanical robustness and reliable system integration for hyperscale and data center deployments.
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com。
