因應 AI 網路對高頻寬密度與高效散熱的需求，鴻騰持續布局整合高密度連接與搭配液冷與矽光設計的 XPO 技術，並將展示用於 AI 伺服器機櫃的 224G NPO（近封裝光學）Socket 方案，拓展更貼近運算晶片的光電連接應用。
鴻騰積極布局光通訊關鍵元件與整合方案，透過深化產業合作、提早對接下一代系統需求，擴大在 AI 供應鏈中的參與範圍。延續此策略，鴻騰預計於 9 月 16 日在台北舉辦「2026 鴻騰科技日」，以「Light at Scale: The Next Frontier in Data Center Interconnects」為主題，透過四場專題演講及產業論壇，探討 AI 光互連的技術方向與商業化機會。
專題演講邀請 Lumentum Dr. Wupen Yuen、NTT Innovative Devices Yoshiaki Sato、前Coherent CEO，現任Avalanche Thinking Dr. Chuck Mattera，以及 ams OSRAM Dr. Ashkan Seyedi 四位業界領袖分享。論壇由鴻騰光通訊顧問劉一誠博士主持，邀集來自Semtech, Ligent, Macom 專家, 以及鴻海研究院半導體研究所所長郭浩中博士，共同交流下一代光通訊的部署挑戰與產業機會。
One Mobility Expands Charging Portfolio to Drive Global Growth and Regional Manufacturing at The smarter E Europe 2026
Munich, Germany – June 2026 – Foxconn Interconnect Technology (FIT) will participate in The smarter E Europe 2026** for the third consecutive year. For the first time, FIT will exhibit under One Mobility, its global automotive platform, highlighting its growing presence in electrification and charging infrastructure markets.
2026-06-23
Munich, Germany – June 2026
Foxconn Interconnect Technology (FIT) will participate in The smarter E Europe 2026** for the third consecutive year. For the first time, FIT will exhibit under One Mobility, its global automotive platform, highlighting its growing presence in electrification and charging infrastructure markets.
A key highlight at this year's exhibition is the debut of the new 80kW DC Charger, complementing the existing 180kW DC Fast Charger and expanding coverage across destination charging, commercial sites, fleet operations, and public charging infrastructure.
The upgraded Anoles Series AC Charger is engineered for reliable full-power operation in demanding outdoor environments. The platform also integrates ISO 15118 Plug & Charge, IEC 62443 cybersecurity readiness, and enhanced metering performance to support next-generation charging infrastructure requirements.
Together, the Anoles Series AC Charger, 80kW DC Charger, and 180kW DC Fast Charger demonstrate One Mobility's commitment to delivering scalable, secure, and future-ready charging solutions across diverse deployment scenarios.
The expanded portfolio further supports FIT's upcoming manufacturing facility in Dammam, Saudi Arabia, strengthening the foundation for future localized production and regional growth.
Visit One Mobility at The smarter E Europe 2026
June 23–25, 2026 Hall B6 | Booth 160
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com。
FIT Sets New AI Interconnect Benchmark at OFC 2026 Advancing from 1.6T Production to Integrated Photonic–Electronic– Thermal Systems
Los Angeles, March 17, 2026 — FIT Hon Teng Limited (06088.HK), a subsidiary of the Foxconn Technology Group, today showcased its latest innovations in AI high-speed interconnect technologies at Optical Fiber Communication Conference (OFC) 2026, South Hall – Booth 1558, signaling the company’s evolution from a connectivity component supplier to a provider of integrated photonic, electronic, and thermal system solutions for next-generation AI infrastructure.
2026-03-17
Los Angeles, March 17, 2026
FIT Hon Teng Limited (06088.HK), a subsidiary of the Foxconn Technology Group, today showcased its latest innovations in AI high-speed interconnect technologies at Optical Fiber Communication Conference (OFC) 2026, South Hall – Booth 1558, signaling the company’s evolution from a connectivity component supplier to a provider of integrated photonic, electronic, and thermal system solutions for next-generation AI infrastructure.
A key highlight is FIT’s live demonstration of its XPO Loopback Connector and Cage with a Host Compliance Board, transmitting at 224 Gbps at Arista Networks (South Hall, Booth 1571) and highlighting insertion and return loss performance. The demo supports the debut of the XPO MSA, with FIT participating as a contributing partner to the ecosystem.
“With the introduction of the XPO Interconnect, the industry takes an important step forward in enabling scalable, high-bandwidth AI infrastructure. XPO brings together advanced cable modules, high-density connector technology, and liquid cooling, to support the high data rate performance and thermal requirements of next-generation computing systems,” says Terry Little, Product Development Engineering Manager and System Architect at FIT.
FIT also introduced an upgraded 2.0 version of its 102.4T ELSFP external laser source module, designed for the Tomahawk-6 CPO architecture. The new generation delivers up to 26 dBm output power per channel and supports 16-channel 1.6T applications. The previous generation 102.4T ELSFP external laser module has already been validated by NTT Innovative Devices. Building on its 51.2T platform, FIT has further enhanced optical coupling precision, connector reliability, and thermal design to ensure scalability and longterm operational stability in large-scale AI deployments.
In addition, FIT has also announced its CPX 500-pin socket solution for designed with NTT Innovative Devices, specifically engineered to meet next-generation AI and HighPerformance Computing (HPC) interconnect requirements at 224G and 448G per lane. This high-density, ultra-thin socket solution facilitates scalable connectivity for advanced switch tray scale-out applications. Jointly designed for superior signal integrity, precise impedance control, and optimized insertion loss, the CPX solution delivers enhanced mechanical robustness and reliable system integration for hyperscale and data center deployments.
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com。
FIT Hon Teng Deepens AI Supply Chain Layout, Leveraging DesignCon 2026 Momentum to Expand Ecosystem Partnerships
Taipei — March 17, 2026 —As global demand for AI computing infrastructure continues to soar, FIT Hon Teng (6088-HK), a subsidiary of Foxconn, is intensifying its strategic positioning within the next-generation AI supply chain. Building on the technical momentum and high-level dialogues with global ecosystem partners during DesignCon 2026, FIT is showcasing its comprehensive technical prowess in key components, including high-speed connectors, cables, liquid cooling manifolds, and high-current power solutions.
2026-03-17
Taipei — March 17, 2026
As global demand for AI computing infrastructure continues to soar, FIT Hon Teng (6088-HK), a subsidiary of Foxconn, is intensifying its strategic positioning within the next-generation AI supply chain. Building on the technical momentum and high-level dialogues with global ecosystem partners during DesignCon 2026, FIT is showcasing its comprehensive technical prowess in key components, including high-speed connectors, cables, liquid cooling manifolds, and high-current power solutions.
Optimizing AI Architecture: High-Performance High-Speed Connectors
Tailored for the latest AI supply chain rack architectures, FIT supplies high-speed connector solutions featuring exceptional signal density and transmission efficiency. This technology enhances assembly flexibility and operational reliability within AI servers, enabling customers to meet the escalating demands for high-speed data exchange and transmission. Through these innovations, FIT continues to cultivate deeper business opportunities with its ecosystem partners.
Liquid Cooling Expertise & Group Synergy: Redefining Rack Power Standards
As a pioneer in liquid cooling connectivity, FIT provides a full range of liquid cooling manifold specifications. By collaborating closely with Foxconn’s internal Cold Plate technology, FIT delivers a more integrated and comprehensive liquid cooling thermal module solution to the market.
FIT’s expertise in integrating Rack Busbars with liquid cooling technology is widely recognized. Beyond being an industry first with the development of the Liquid Cooling Power Busbar (LC Busbar), FIT offers highly customized specifications to meet diverse client needs. In the rigorous environments of AI high-performance computing (HPC), this solution increases rack power transmission efficiency by 2 to 3 times, significantly optimizing power delivery within the same physical footprint. The LC Busbar utilizes a 48VDC architecture with a rated current capacity of at least 5000A, ensuring stable and robust power delivery even under extreme computational loads.
Resilient Power Backbone: 400A Ultra-High Current Power Whip
To support the high-density power requirements of AI computing, FIT offers its industry-leading Power Whip solution, capable of handling currents up to 400A. This achievement not only meets the requirements of current high-power server racks but also demonstrates FIT’s R&D momentum in developing core data center technologies, further strengthening business alignment with partners in power distribution systems.
By leveraging the Foxconn Group's vertical integration and CMM (Component Module Move) expertise, FIT Hon Teng delivers high-performance, precision components that satisfy the most demanding global requirements for high-speed transmission and low-loss power delivery. FIT remains committed to securing its vital position in the AI supply chain while co-creating new business opportunities with its ecosystem partners.
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com。
FIT Advances 102.4T CPO External Laser Platform into Validation - FIT Deepens Its Commitment to AI Optical Interconnect Infrastructure
Taipei, March 2, 2026 — FIT Hon Teng Limited (HKEX: 06088), a subsidiary of Hon Hai Technology Group, today announced that its 102.4T Co-Packaged Optics (CPO) External Laser Solution has completed key development milestones and entered ecosystem validation. FIT will be exhibiting at OFC 2026 (Optical Fiber Communication Conference and Exposition) from March 16–19, underscoring its strategic focus on next-generation AI optical interconnect infrastructure. We look forward to seeing you at the world’s largest international event for optical networking and communications.
2026-03-02
Taipei, March 2, 2026 —
FIT Hon Teng Limited (HKEX: 06088), a subsidiary of Hon Hai Technology Group, today announced that its 102.4T Co-Packaged Optics (CPO) External Laser Solution has completed key development milestones and entered ecosystem validation. FIT will be exhibiting at OFC 2026 (Optical Fiber Communication Conference and Exposition) from March 16–19, underscoring its strategic focus on next-generation AI optical interconnect infrastructure. We look forward to seeing you at the world’s largest international event for optical networking and communications.
As AI training clusters and hyperscale data centers transition toward 102.4T switching platforms, the industry is accelerating adoption of CPO architectures to address power density, signal integrity, and thermal constraints. Leveraging its long-standing expertise in high-speed interconnect and precision opto-mechanical integration, FIT has expanded its capabilities into external laser modules and package-level optical integration, enabling scalable system-level CPO deployments.
FIT’s 102.4T ELSFP (External Laser Small Form-Factor Pluggable) platform delivers a modular, hot-pluggable laser source designed to support serviceability and operational flexibility in CPO-based systems. The solution is compliant with OIF ELSFP 2.0 and CMIS Rev 5.1 specifications and utilizes a 1310 nm CW DFB laser architecture with output power exceeding 20 dBm. Total module power consumption is maintained below 10 W, with up to 20 dB optical link budget, meeting the performance envelope required for next-generation AI switch fabrics.
The platform has been technically validated by NTT Innovative Devices and aligns with the Photonics Electronics Convergence Devices roadmap under the IOWN architecture. Building on its 51.2T development experience, FIT has further enhanced optical coupling accuracy, high-density interconnect reliability, and advanced thermal design to ensure manufacturability, yield stability, and long-term field reliability at the 102.4T node.
The 102.4T ELSFP platform will be showcased at OFC 2026 at FIT’s booth (Booth 1558), featuring detailed module architecture and live performance demonstrations. The solution will also be incorporated into a system-level switching architecture demonstration at the NTT Innovative Devices booth (Booth 629), where FIT is identified as the external laser source provider, reflecting active collaboration within the CPO ecosystem.
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com。
FIT (Foxconn Interconnect Technology) Makes Its Debut at DesignCon 2026: Launching Its 448G CHIPLINK® Solution, Leading a Revolution in AI Data Center Computing Power
[Santa Clara, CA – February 23, 2026] – Foxconn Interconnect Technology (FIT, 6088-HK), a leading provider of connectivity solutions under Hon Hai Technology Group (2317-TW), will showcase its latest innovations at DesignCon 2026 (Booth #719) from February 24–26. Addressing the surging power demands of the AI era, FIT is presenting its vision, "Shaping the Future of Data and Power: From Chips to Grid," featuring comprehensive AI data center solutions including 1.6T interconnects, Next-Gen CHIPLINK® 448G Solutions and next-generation liquid cooling technologies.
2026-02-23
[Santa Clara, CA – February 23, 2026]
Foxconn Interconnect Technology (FIT, 6088-HK), a leading provider of connectivity solutions under Hon Hai Technology Group (2317-TW), will showcase its latest innovations at DesignCon 2026 (Booth #719) from February 24–26. Addressing the surging power demands of the AI era, FIT is presenting its vision, "Shaping the Future of Data and Power: From Chips to Grid," featuring comprehensive AI data center solutions including 1.6T interconnects, Next-Gen CHIPLINK® 448G Solutions and next-generation liquid cooling technologies.
Where Tech Aesthetics Meet Performance: Comprehensive Adaptability
FIT’s booth features a refreshed corporate identity, highlighted by a futuristic geometric angled archway that serves as a bridge between visitors and the technology on display. The design uses layered lines to symbolize the convergence of signals, energy, and information. The layout guides visitors through a narrative journey, showcasing FIT’s ability to integrate connectivity across the entire spectrum — from the power grid down to the silicon chip.
Five Core Highlights: Defining Next-Gen High-Speed Transmission
At this exhibition, FIT is fully promoting its critical technologies specifically designed for AI and High-Performance Computing (HPC) architectures:
1.6T High-Speed Interconnects: Engineered for next-generation AI architectures, providing ultra-high-density bandwidth to satisfy extreme instantaneous data transfer requirements.
Next-Gen CHIPLINK® 448G Solutions: Specifically designed to address the escalating signal integrity, high density, and mechanical integration challenges of 224G and 448G AI/HPC systems. The CHIPLINK® CPC (Cabled Protein Card) architecture utilizes a socketed modular wafer design supporting 30–34 AWG cabling, offering flexible scaling for CPC-to-I/O, CPC-to-CPC, and CPC-to-Backplane topologies. This solution optimizes high-density differential pair routing while significantly improving insertion loss (IL) and crosstalk performance.
Advanced Liquid Cooling: Superior thermal management performance tailored for hyperscale data centers and AI clusters to combat the heat challenges of rising compute density.
PCIe® 6.0 / 7.0 Cabling Solutions: High-performance, low-latency expansion options that optimize connectivity efficiency for AI computing resources.
RF Waveguide Interconnects: Developed in collaboration with Point2 Technology, these cutting-edge high-frequency solutions offer an alternative to traditional copper and fiber, effectively addressing power consumption, reach, and integration hurdles at extreme data rates.
Breaking Physical Barriers: Power Management as the Key to HPC
"The challenge today is no longer just about raw speed; power management is the core priority," said Joseph Wang, CTO of FIT, regarding the structural challenges of AI computing. "Through advanced connectivity, we are committed to helping customers seamlessly integrate high-power components into key AI rack locations without overhauling existing architectures. This ensures data transmission at ultra-low latency while overcoming the physical limits of signal loss."
A Milestone in Transformation: From Components to High-End AI Solutions
FIT’s presence at DesignCon 2026 marks a significant milestone in its evolution from a traditional component manufacturer to a provider of high-end AI computing solutions. Visit us at DesignCon, booth No. 719, where our professional team will present a full range of high-speed data and power transmission solutions.
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at https://www.fit-foxconn.com/.
_1.png)
.png)
