Taipei, March 2, 2026 —FIT Hon Teng Limited (HKEX: 06088), a subsidiary of Hon Hai Technology Group, today announced that its 102.4T Co-Packaged Optics (CPO) External Laser Solution has completed key development milestones and entered ecosystem validation. FIT will be exhibiting at OFC 2026 (Optical Fiber Communication Conference and Exposition) from March 16–19, underscoring its strategic focus on next-generation AI optical interconnect infrastructure.
We look forward to seeing you at the world’s largest international event for optical networking and communications.
As AI training clusters and hyperscale data centers transition toward 102.4T switching platforms, the industry is accelerating adoption of CPO architectures to address power density, signal integrity, and thermal constraints. Leveraging its long-standing expertise in high-speed interconnect and precision opto-mechanical integration, FIT has expanded its capabilities into external laser modules and package-level optical integration, enabling scalable system-level CPO deployments.
FIT’s 102.4T ELSFP (External Laser Small Form-Factor Pluggable) platform delivers a modular, hot-pluggable laser source designed to support serviceability and operational flexibility in CPO-based systems. The solution is compliant with OIF ELSFP 2.0 and CMIS Rev 5.1 specifications and utilizes a 1310 nm CW DFB laser architecture with output power exceeding 20 dBm. Total module power consumption is maintained below 10 W, with up to 20 dB optical link budget, meeting the performance envelope required for next-generation AI switch fabrics.
The platform has been technically validated by NTT Innovative Devices and aligns with the Photonics Electronics Convergence Devices roadmap under the IOWN architecture. Building on its 51.2T development experience, FIT has further enhanced optical coupling accuracy, high-density interconnect reliability, and advanced thermal design to ensure manufacturability, yield stability, and long-term field reliability at the 102.4T node.
The 102.4T ELSFP platform will be showcased at OFC 2026 at FIT’s booth (Booth 1558), featuring detailed module architecture and live performance demonstrations. The solution will also be incorporated into a system-level switching architecture demonstration at the NTT Innovative Devices booth (Booth 629), where FIT is identified as the external laser source provider, reflecting active collaboration within the CPO ecosystem.
