San Jose, California　– October 15, 2024 –　Foxconn Interconnect Technology (FIT) is excited to present at the upcoming OCP Global Summit, focusing on the impact of immersion cooling on signal integrity in IT platforms. The Open Compute Project (OCP) is a global initiative that seeks to redesign hardware infrastructure to meet the growing demands of modern data centers. FIT’s session, led by Terry Little, Development Engineering Manager, will tackle a critical issue faced by the industry: maintaining high-speed signal integrity in immersion-cooled environments.
At this year’s OCP Global Summit, FIT will introduce advanced solutions to optimize signal transmission within immersion-cooled IT platforms. Immersion cooling, where electronic components are submerged in a dielectric fluid, is becoming a key technology for reducing heat and improving efficiency in high-density computing environments. However, it presents unique challenges to signal integrity, particularly for high-speed data transmission lines.
The session titled “Optimizing Signal Integrity in Immersion-Cooled IT Platforms” will highlight the effects of dielectric fluids on high-speed signal testing and propose solutions to enhance testing methods and connector performance. Terry Little will discuss how fixture improvements can further support consistent signal transmission, ensuring reliable performance in AI and data center applications.
Key topics covered will include:

‧ The influence of immersion fluids on high-speed signal lines
‧ Challenges faced during high-speed testing in immersion-cooled environments
‧ Innovative connector fixture strategies to improve signal integrity
FIT’s ongoing efforts to innovate in AI-driven data center solutions are showcased in their growing portfolio of cutting-edge connectivity products, including high-speed and high-power connectors that maintain performance in harsh environments such as immersion cooling systems.