Foxconn Interconnect Technology Showcases PCIe6 and PCIe7 with Alphawave Semi at DesignCon 2025.
Santa Clara, Calif., January 28, 2025 -- Foxconn Interconnect Technology (6088.HK) (“FIT”), a leading connective solution provider creating powerful connections for a better world, today announced the demonstration of it’s PCI Express® (PCIe®) 6.0 signal transmission through their CDFP SMT connector with a Passive DAC cable and also PCIe 7.0®-capable transmission through their OSFP-XD SMT connector with a Passive DAC cable at the DesignCon 2025 exhibition in Santa Clara, California from January 28th to January 30th, 2025.
FIT’s own CDFP SMT connector and Passive DAC cable will appear together with Alphawave Semi’s 64 GT/ PCIe 6.0® Subsystem for Disaggregated Networks.
Alphawave Semi’s PipeCORE? is their PCIe 6.0 Subsystem IP Supporting CDFP PCIe Direct Attach Cabling which will enable the industry to make the move to disaggregated server resources within a data center rack. Alphawave Semi’s complete PCIe 6.0® subsystem solution is supporting FIT’s CDFP PCIe Direct Attach Cables and delivering a max reach of 4 meters. This advanced integration leverages Alphawave Semi's sophisticated controller IP and top-tier PAM4 SerDes PHY, delivering unmatched performance at the lowest power and lowest latency channel solution. Witness how these combined technologies redefine connectivity and throughput in cutting-edge data centers, setting new standards for the PCIe 6.0® ecosystem and PCI-SIG’s CopprLink.
In addition, FIT’s own OSFP-XD SMT connector and Passive DAC cable will appear together with Alphawave Semi’s 128 GT/ PCIe 7.0® Performance System for Scale Up Networks.
Alphawave Semi’s PipeCORE? is their PCIe 7.0® IP Supporting OSFP-XD PCIe Direct Attach Cabling which will enable the industry to make the move to high-speed, high bandwidth-density scale up resources within a data center rack, Alphawave Semi’s PCIe 7.0® solution leveraging our industry pioneering 112G DSP-based SerDes, are already here supporting FIT’s OSFP-XD PCIe Direct Attach Cables and delivering a max reach of 2 meters, ideal for scale-up networks. This advanced integration leverages Alphawave Semi's top-tier PAM4 SerDes PHY, delivering unmatched performance at the lowest power and lowest latency channel solution. Highly correlated models with in-lab measurements enable fast to market, complete solutions at 128 Gbps.
Applications:
‧ Telecom/High-Performance Computing Systems
‧ Data Center Switches, Routers and Servers Configurations to accommodate 112 Gbps and PCIe 6.0® and 7.0®
Protocols Supported:
‧ IEEE 802.3ck
‧ IEEE 802.3dj (in progress)
‧ OSFP-XD MSA specification
‧ PCIe Gen6 and Gen7 ecosystem
‧ PCI-SIG CopprLink specification
‧ CXL Standard
About FIT Hon Teng
Foxconn Interconnect Technology (FIT) is a leading global solutions developer and manufacturer, cultivating connectivity for a better world. With unsurpassed capabilities in development, research, manufacturing engineering and design, production, supply chain, and go-to-market planning for world class brands and private label products spanning B2C and B2B categories, FIT is at the forefront of worldwide technological trends delivering compelling user experiences at scale. With offices and manufacturing sites located in Asia, the Americas and Europe, FIT is a global leader in the manufacturing of high precision interconnect components. For more information, visit FIT’s website: https://www.fit-foxconn.com.
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EMAIL: fit-ir@fit-foxconn.com
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