[Taipei, October 9 2025] - FIT Hon Teng (6088-HK), a subsidiary of Hon Hai Technology Group (Foxconn, 2317-TW), will showcase its latest break throughs in high-speed data connectivity, high-power delivery, and thermal management solutions for AI data centers during the OCP Global Summit 2025, held from October 14 to 16, 2025.
As the power consumption of Artificial Intelligence (AI) and high-performance computing rapidly escalates, the data center industry has reached a critical juncture in its demand for both ultra-high-speed transmission and efficient thermal dissipation. At the summit, FIT will offer a comprehensive look at its technological leap into the 224G generation through both dynamic and static demonstrations. This showcase will feature its complete AI solutions, next-generation CPC products, 224G high-speed interconnects, and 51.2T switch cooling technology.
For the first time, FIT will dynamically demonstrate its 224G OSFP Cold Plate Liquid Cooling Solution. This solution is designed to maintain server stability under extreme thermal loads while significantly boosting both power efficiency and rack density. Another key highlight is the Elevated OSFP Connector and Cage System, which ensures reliable operation for next-generation optical modules in ultra-high-speed environments through superior signal integrity and electromagnetic interference protection. FIT will also introduce its complete range of 1.6T active and passive copper cables, which strikes an optimal balance between performance, cost, and power consumption.
Furthermore, FIT will fully exhibit its deep capabilities in AI data center infrastructure, providing a solid foundation for the next generation of computing architectures. Featured exhibits will include Chip-to-Chip Connectivity Solutions such as CPU/GPU sockets, and High-Speed I/O Computing Interconnect Solutions like PCIe Gen6 high-speed connectors and cables, along with backplane connectors. The showcase will also present full-flow quick disconnect liquid cooling couplers, including the dedicated FD83 and UQD06/UQD08 connectors, emphasizing their ease of plugging/unplugging and the stable signal quality of their floating design. In the high-voltage direct current (HVDC) power domain, FIT will unveil Power Busbars and Power Cables. Complementing these are active and passive optical cables and high-end internal transmission cables, delivering a comprehensive high-speed transmission solution from internal components to external connections.
During the event, Terry Little of FIT and Intel will co-present a Keynote Speech on October 16 titled “SI in Immersion Cooling Technology”. This in-depth presentation will further underscore FIT’s pivotal role and technological influence within the industry ecosystem.
FIT's strategy extends beyond individual products. It focuses on responding to market needs with complete solutions to build the cornerstone of next-generation AI computing. This positioning signifies that FIT is more than a product supplier. It is a key enabler driving enhanced data center efficiency and energy sustainability. We are committed to collaborating with all excellent industry partners to build a superior supply chain.
Attendees are invited to visit Suite 826 at the Hilton San Jose to experience FIT’s latest achievements firsthand.
About Foxconn Interconnect Technology (FIT Hon Teng)
Foxconn Interconnect Technology (HKEX: 6088) was listed on the Hong Kong Stock Exchange in 2017 and is the largest consumer electronics connector manufacturer in Greater China. While connectors remain its core business, the company has strategically expanded in recent years into 5G AIoT, electric vehicles, and acoustic electronic components, while also entering the consumer brand sector. For more information, please visit the company’s website at www.fit-foxconn.com
About OCP Global Summit
The OCP Global Summit offers a unique platform for the worldwide community to share insights, foster collaboration, and showcase cutting-edge advancements in open hardware and software. It is dedicated to driving openness, efficiency, sustainability, scalability, and growth within the data center and edge technology ecosystems.
Media Contact:
Email: fit-ir@fit-foxconn.com
Product and Service Inquiries:
Europe and America Contact: sales-usa@fit- foxconn.com
